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TLV2553IDWRG4

Texas Instruments

TLV2553IDWRG4 by Texas Instruments

TLV2553IDWRG4 by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 3/5 V power supplies. Ideal for industrial applications, it offers a 0.2 MHz sample rate, BINARY output code, and operates b/w -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,143 parts In-Stock

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Digiode

USA . 2,819 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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AZTECH Wire

Italy . 624 parts In-Stock

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$9.189

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$9.189

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Parana Technologies

USA . 102 parts In-Stock

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$14.425

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$14.867

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102

$14.425

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DigiPath Technology Company

USA . 1,011 parts In-Stock

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$15.884

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$14.613

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$15.884

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ChromeModa Solutions

Germany . 2,501 parts In-Stock

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$16.208

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$13.291

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$16.208

$13.291

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

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$16.208

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$15.398

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$14.587

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2,102

$16.208

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$14.587

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One Stop Electronics

USA . 845 parts In-Stock

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$18.000

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845

$18.000

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Corohmni

South Africa . 52 parts In-Stock

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$22.146

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Ampacity Inc.

Singapore . 1,543 parts In-Stock

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$32.000

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Continental Prestige Electronics

USA . 4,971 parts In-Stock

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Argo Parts USA

USA . 2,602 parts In-Stock

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Corphita

USA . 981 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Upgrade your analog-to-digital conversion with the TLV2553IDWRG4 by Texas Instruments. With 11 analog input channels and a maximum linearity error of just 0.0244%, this ADC offers precision and reliability for industrial-grade applications. The small outline package and low supply current of 1.2mA make it ideal for space-constrained designs. Trust Texas Instruments for high-quality components that deliver exceptional performance every time. Experience the value and benefits of the TLV2553IDWRG4 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ADC, ensuring a longer lifespan.

No. of Analog In Channels: 11

Allows for a versatile range of input signals to be converted into digital data, providing flexibility in applications.

Surface Mount: YES

Enables easy integration into PCB designs, saving space and simplifying assembly processes.

No. of Bits: 12

Provides higher resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0244 %

Ensures high precision and accuracy in the conversion process, resulting in reliable digital data output.

Power Supplies (V): 3/5

Offers flexibility in power requirements, allowing the ADC to be used in a variety of voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges, ensuring stable performance in challenging conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, making it suitable for a wide range of applications.

Maximum Analog Input Voltage: 5.5 V

Can accept a wide range of analog input voltages, accommodating different signal levels.

Sample Rate: 0.2 MHz

Provides a fast sampling rate, enabling quick conversion of analog signals to digital data.

Technical Specifications

Analog-to-Digital Converters TLV2553IDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

4.15 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

1.2 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.505 in (12.825 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2553IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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