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TLV2556MPWREP

Texas Instruments

TLV2556MPWREP by Texas Instruments

TLV2556MPWREP by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 3/5 V power supplies. Ideal for military applications due to its MIL temperature grade, it features a sample rate of 0.2 MHz and operates at -55 to 125 °C. With a small outline package style, it offers fast conversion time of 6.46 us.

Median Price

$341.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,414 parts In-Stock

1+ parts

$341.030

100+ parts

$283.221

1k+ parts

-

10k+ parts

$255.383

1,414

$341.030

$283.221

-

$255.383

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$11.676

100+ parts

-

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75

$11.676

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Digiode

USA . 2,824 parts In-Stock

1+ parts

$148.152

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2,824

$148.152

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Vyrian

USA . 1,782 parts In-Stock

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1,782

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Component Sense

UK . 973 parts In-Stock

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973

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Cyclops Electronics Ltd

UK . 152 parts In-Stock

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152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,157 parts In-Stock

1+ parts

$10.485

100+ parts

-

1k+ parts

$10.995

10k+ parts

-

1,157

$10.485

-

$10.995

-

Continental Prestige Electronics

USA . 4,423 parts In-Stock

1+ parts

$11.676

100+ parts

-

1k+ parts

-

10k+ parts

$11.442

4,423

$11.676

-

-

$11.442

Netroflash

USA . 500 parts In-Stock

1+ parts

$11.676

100+ parts

-

1k+ parts

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500

$11.676

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-

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ChromeModa Solutions

Germany . 6,592 parts In-Stock

1+ parts

$11.781

100+ parts

$9.660

1k+ parts

-

10k+ parts

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6,592

$11.781

$9.660

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IDEA Electronic Components Group

UK . 1,142 parts In-Stock

1+ parts

$11.781

100+ parts

$11.192

1k+ parts

$10.603

10k+ parts

-

1,142

$11.781

$11.192

$10.603

-

Microchip USA

USA . 3,533 parts In-Stock

1+ parts

$31.260

100+ parts

$30.810

1k+ parts

$30.590

10k+ parts

$30.360

3,533

$31.260

$30.810

$30.590

$30.360

Ampacity Inc.

Singapore . 2,083 parts In-Stock

1+ parts

$132.560

100+ parts

-

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2,083

$132.560

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Corphita

USA . 2,562 parts In-Stock

1+ parts

$140.355

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2,562

$140.355

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Lixinc

USA . 15,734 parts In-Stock

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15,734

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 4,749 parts In-Stock

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4,749

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Argo Parts USA

USA . 3,385 parts In-Stock

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3,385

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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DigiPath Technology Company

USA . 1,727 parts In-Stock

1+ parts

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100+ parts

$10.622

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1,727

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$10.622

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Elevate your analog-to-digital conversion experience with the TLV2556MPWREP by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers quality products that exceed expectations. This 12-bit ADC offers 11 analog input channels in a compact package, making it ideal for a wide range of applications. With a fast conversion time and low power consumption, this ADC provides precise measurements while maximizing efficiency. Trust Texas Instruments to provide reliable solutions for your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring a longer lifespan for the product.

No. of Analog In Channels: 11

With a high number of analog input channels, this product offers versatility and flexibility for connecting multiple sources for conversion.

Surface Mount: YES

Being surface mountable makes this product easy to integrate onto circuit boards, saving space and making assembly more efficient.

No. of Bits: 12

The 12-bit resolution provides high accuracy in conversion, allowing for precise measurements and data acquisition.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accuracy and consistency in converting analog signals to digital, making this product reliable for various applications.

Power Supplies (V): 3/5

This dual voltage option allows for compatibility with different power sources, adding versatility to where this product can be used.

No. of Terminals: 20

Having a sufficient number of terminals facilitates easy connection and installation of the product onto a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and streamlined package style saves space on the board, making it ideal for applications with limited room.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement makes this product suitable for low-power applications or instances where power conservation is essential.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and high heat levels.

Minimum Operating Temperature: -55 °C

The wide range of operating temperatures allows this product to be used in extreme cold environments without risking performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and longevity of the product.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in installation and compatibility with various circuit configurations.

Maximum Conversion Time: 6.46 us

The fast conversion time enables quick processing of analog signals, making this product suitable for real-time applications.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact design, making this product suitable for applications with limited vertical space.

Width: 4.4 mm

The narrow width of the product saves space on the circuit board, allowing for more components to be integrated.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this product suitable for soldering processes that require high heat.

Length: 6.5 mm

The compact length of the product contributes to its space-saving design, ideal for compact electronic devices.

Temperature Grade: MILITARY

The military-grade temperature rating indicates that this product meets high standards for reliability and performance in tough environmental conditions.

Maximum Analog Input Voltage: 5.5 V

The high maximum analog input voltage capability allows for compatibility with a wide range of signal sources.

Sample Rate: 0.2 MHz

The high sample rate enables fast and accurate conversion of analog signals, making this product suitable for high-speed applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure soldering and robust connections, ensuring reliability in various operating conditions.

Maximum Supply Current: 2.4 mA

The low maximum supply current requirement indicates energy efficiency and suitability for low-power applications.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high speed and accuracy in converting analog signals to digital, making this product suitable for demanding applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides compatibility with standard power sources, simplifying integration into existing systems.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

The binary and 2's complement binary output bit codes offer flexibility and compatibility with different data processing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact placement of terminals on the package, contributing to a space-saving design.

Minimum Analog Input Voltage: 0 V

The capability to accept 0V analog input signals provides flexibility for different signal sources and compatibility with various sensors or devices.

Output Format: SERIAL

The serial output format enables easy interfacing with other digital systems, allowing for seamless data transmission and integration.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold function ensures accurate conversion of analog signals by capturing and holding the input voltage during the conversion process.

Technical Specifications

Analog-to-Digital Converters TLV2556MPWREP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

6.46 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2.4 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2556MPWREP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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