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TLV2473IDGQ

Texas Instruments

TLV2473IDGQ by Texas Instruments

TLV2473IDGQ by Texas Instruments is a CMOS Operational Amplifier with 2 functions, featuring low bias current of 0.00005 uA @25C and high common mode rejection ratio of 78 dB. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and has a unity gain bandwidth of 2800 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,978 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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217

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Semicontronic

India . 1,380 parts In-Stock

1+ parts

$3.410

100+ parts

$3.325

1k+ parts

$3.308

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1,380

$3.410

$3.325

$3.308

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Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

$3.989

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-

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$4.456

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1,501

$3.989

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$4.456

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IDEA Electronic Components Group

UK . 2,046 parts In-Stock

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$4.482

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$4.034

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2,046

$4.482

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$4.034

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ChromeModa Solutions

Germany . 33 parts In-Stock

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$4.482

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$3.675

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33

$4.482

$3.675

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One Stop Electronics

USA . 1,620 parts In-Stock

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$8.410

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1,620

$8.410

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AZTECH Wire

Italy . 287 parts In-Stock

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$11.785

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287

$11.785

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Component Stockers USA

USA . 352 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 2,310 parts In-Stock

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DigiPath Technology Company

USA . 2,012 parts In-Stock

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$4.041

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2,012

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$4.041

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A-Z Elektronik GmbH

Germany . 1,127 parts In-Stock

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Microchip USA

USA . 233 parts In-Stock

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Overview

Enhance your electronic designs with the TLV2473IDGQ Operational Amplifier by Texas Instruments. Elevate your projects with the quality and expertise of a trusted industry leader. Ideal for a wide range of applications, this innovative product offers unmatched precision and reliability. Experience the value and benefits of Texas Instruments' cutting-edge technology, providing you with superior performance and efficiency. Elevate your creations with the TLV2473IDGQ and unlock endless possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 2400 uV

Ensures minimal error in the output signal by reducing the input offset voltage, leading to accurate amplification.

Maximum Average Bias Current (IIB): 0.0003 uA

Low bias current results in minimal distortion and improved precision in signal amplification.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Common Mode Reject Ratio: 78 dB

Provides high rejection of common mode noise, ensuring a clean output signal in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a nominal supply voltage of 3V, suitable for a wide range of applications.

Minimum Slew Rate: 0.6 V/us

Fast slew rate allows for rapid response to input signal changes, making it ideal for applications requiring quick signal processing.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals accurately and efficiently, making it a reliable choice for various electronic circuits.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2473IDGQ attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

78 dB

Input Offset Voltage Limit:

2400 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.6 V/us

Nominal Slew Rate:

1.4 V/us

Peak Bias Current:

300 pA

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP10,.19,20

Trade Compliance

TLV2473IDGQ Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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