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TLV2463CDGSG4

Texas Instruments

TLV2463CDGSG4 by Texas Instruments

TLV2463CDGSG4 by Texas Instruments is a dual operational amplifier with 2200uV max input offset voltage, 80dB CMRR, and 5200kHz unity gain bandwidth. Ideal for precision signal conditioning in commercial applications due to its low bias current and high slew rate of 0.8 V/us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,529 parts In-Stock

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8,529

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Digiode

USA . 2,882 parts In-Stock

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Cyclops Electronics Ltd

UK . 674 parts In-Stock

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Sunrise Surplus Inc.

USA . 13 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 552 parts In-Stock

1+ parts

$0.945

100+ parts

-

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$1.851

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552

$0.945

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$1.851

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DigiPath Technology Company

USA . 1,906 parts In-Stock

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$1.041

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$0.957

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1,906

$1.041

$0.957

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IDEA Electronic Components Group

UK . 440 parts In-Stock

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$1.062

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$0.956

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440

$1.062

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$0.956

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ChromeModa Solutions

Germany . 327 parts In-Stock

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$1.062

100+ parts

$0.871

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327

$1.062

$0.871

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Ampacity Inc.

Singapore . 1,251 parts In-Stock

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$2.410

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$2.410

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One Stop Electronics

USA . 1,033 parts In-Stock

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$4.410

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1,033

$4.410

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AZTECH Wire

Italy . 761 parts In-Stock

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$16.323

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Component Stockers USA

USA . 539 parts In-Stock

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$99.990

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Microchip USA

USA . 5,829 parts In-Stock

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Corphita

USA . 1,165 parts In-Stock

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Perfect Parts

USA . 441 parts In-Stock

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Kepictronics

USA . 355 parts In-Stock

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Overview

Experience superior performance and precision with the TLV2463CDGSG4 operational amplifier by Texas Instruments. Known for their high-quality components and innovative technology, Texas Instruments delivers unmatched reliability and durability in the field of operational amplifiers. Ideal for a wide range of applications, this op amp offers customers exceptional value with its low bias current, high common mode rejection ratio, and fast slew rate. Whether you're designing audio equipment, medical devices, or industrial control systems, trust Texas Instruments to provide the high-performance components you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 2200 uV

Low input offset voltage helps in minimizing errors in signal processing applications.

Maximum Average Bias Current (IIB): 0.025 uA

Low bias current ensures minimal power consumption and accurate signal processing.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in reducing noise and distortion in the output signal.

Nominal Supply Voltage / Vsup (V): 3

Suitable nominal supply voltage for a wide range of applications.

Maximum Supply Voltage Limit: 6 V

Ability to handle high supply voltages while maintaining stability in operation.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance for efficient signal processing.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying and processing signals with high accuracy and stability.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2463CDGSG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

28000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Peak Bias Current:

25 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

10

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP10,.19,20

Trade Compliance

TLV2463CDGSG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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