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TLIN24413DMTTQ1

Texas Instruments

TLIN24413DMTTQ1 by Texas Instruments

TLIN24413DMTTQ1 by Texas Instruments is an AEC-Q100 compliant Ethernet transceiver with 14 terminals in a small outline package. It operates b/w -40 to 125 °C, supporting data rates up to 0.1 Mbps. Ideal for automotive applications due to its low profile and lead-free terminal finish.

Median Price

$3.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,687 parts In-Stock

1+ parts

$2.540

100+ parts

$2.098

1k+ parts

$1.134

10k+ parts

-

26,687

$2.540

$2.098

$1.134

-

Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$3.880

100+ parts

$2.370

1k+ parts

$2.080

10k+ parts

$2.020

83

$3.880

$2.370

$2.080

$2.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,981 parts In-Stock

1+ parts

$2.413

100+ parts

-

1k+ parts

-

10k+ parts

-

3,981

$2.413

-

-

-

Vyrian

USA . 6,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,729

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 874 parts In-Stock

1+ parts

$2.286

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$2.286

-

-

-

Parana Technologies

USA . 361 parts In-Stock

1+ parts

$8.443

100+ parts

-

1k+ parts

$9.085

10k+ parts

-

361

$8.443

-

$9.085

-

IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$9.487

100+ parts

$9.013

1k+ parts

$8.538

10k+ parts

-

1,871

$9.487

$9.013

$8.538

-

ChromeModa Solutions

Germany . 1,554 parts In-Stock

1+ parts

$9.487

100+ parts

$7.779

1k+ parts

-

10k+ parts

-

1,554

$9.487

$7.779

-

-

Microchip USA

USA . 2,148 parts In-Stock

1+ parts

$14.045

100+ parts

-

1k+ parts

-

10k+ parts

-

2,148

$14.045

-

-

-

DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

-

100+ parts

$8.553

1k+ parts

-

10k+ parts

-

1,041

-

$8.553

-

-

Overview

Upgrade your automotive network interfaces with the TLIN24413DMTTQ1 by Texas Instruments. Designed with the highest quality materials and AEC-Q100 screening, this Ethernet transceiver offers reliable performance in extreme temperatures from -40°C to 125°C. Its small outline and very thin profile make it perfect for space-constrained applications. Trust Texas Instruments for cutting-edge technology that ensures a seamless connection in your automotive systems. Experience the value and benefits of superior networking solutions with the TLIN24413DMTTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to heat and moisture, making this product suitable for various operating environments.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs, making it convenient for integration into electronic devices.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures reliability and quality, meeting automotive industry standards for performance and durability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enables this network interface to function efficiently in demanding thermal conditions, enhancing its overall reliability.

Data Rate: 0.1 Mbps

The data rate of 0.1 Mbps provides adequate speed for basic networking needs, making this product suitable for various applications where high data rates are not required.

Technical Specifications

Network Interfaces TLIN24413DMTTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

.1 Mbps

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLIN24413DMTTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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