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TLIN10285DRBRQ1

Texas Instruments

TLIN10285DRBRQ1 by Texas Instruments

TLIN10285DRBRQ1 by Texas Instruments is a network interface IC with 1 channel and a data rate of 0.02 Mbps. It operates in automotive temperature range (-40 to 125 °C) and has a small outline package style with 8 terminals. Suitable for interface circuit applications.

Median Price

$1.630

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,104 parts In-Stock

1+ parts

$1.351

100+ parts

$1.039

1k+ parts

$0.547

10k+ parts

-

3,104

$1.351

$1.039

$0.547

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DigiKey

USA . 19,537 parts In-Stock

1+ parts

$1.630

100+ parts

$0.965

1k+ parts

$0.866

10k+ parts

-

19,537

$1.630

$0.965

$0.866

-

Mouser Electronics

USA . 7,039 parts In-Stock

1+ parts

$1.660

100+ parts

$0.972

1k+ parts

$0.866

10k+ parts

$0.793

7,039

$1.660

$0.972

$0.866

$0.793

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.863

100+ parts

-

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200

$0.863

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Digiode

USA . 4,379 parts In-Stock

1+ parts

$1.283

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4,379

$1.283

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Chip Stock

USA . 125,477 parts In-Stock

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125,477

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ComSIT Distribution GmbH

Germany . 102,000 parts In-Stock

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102,000

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ComSIT USA

USA . 102,000 parts In-Stock

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Vyrian

USA . 3,006 parts In-Stock

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3,006

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.846

100+ parts

-

1k+ parts

$0.812

10k+ parts

-

1,000

$0.846

-

$0.812

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Continental Prestige Electronics

USA . 3,614 parts In-Stock

1+ parts

$0.863

100+ parts

-

1k+ parts

-

10k+ parts

$0.846

3,614

$0.863

-

-

$0.846

Argo Parts USA

USA . 2,761 parts In-Stock

1+ parts

$0.863

100+ parts

-

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2,761

$0.863

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Ampacity Inc.

Singapore . 3,301 parts In-Stock

1+ parts

$1.150

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3,301

$1.150

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Semicontronic

India . 3,063 parts In-Stock

1+ parts

$1.150

100+ parts

$1.121

1k+ parts

$1.116

10k+ parts

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3,063

$1.150

$1.121

$1.116

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Corphita

USA . 3,757 parts In-Stock

1+ parts

$1.216

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3,757

$1.216

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Corohmni

South Africa . 30 parts In-Stock

1+ parts

$8.162

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30

$8.162

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Parana Technologies

USA . 717 parts In-Stock

1+ parts

$12.466

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$12.907

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717

$12.466

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$12.907

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DigiPath Technology Company

USA . 1,690 parts In-Stock

1+ parts

$13.727

100+ parts

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1,690

$13.727

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IDEA Electronic Components Group

UK . 1,360 parts In-Stock

1+ parts

$14.007

100+ parts

$13.307

1k+ parts

$12.606

10k+ parts

-

1,360

$14.007

$13.307

$12.606

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ChromeModa Solutions

Germany . 559 parts In-Stock

1+ parts

$14.007

100+ parts

$11.486

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559

$14.007

$11.486

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Component Connect

USA . 62,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 36,992 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Lixinc

USA . 4,142 parts In-Stock

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A-Z Elektronik GmbH

Germany . 220 parts In-Stock

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220

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Overview

Discover the TLIN10285DRBRQ1 by Texas Instruments, a high-quality Network Interface designed for automotive applications. With its small outline package and dual terminal position, this product offers easy installation and reliable performance. Benefit from its impressive data rate of 0.02 Mbps and nominal supply voltage of 12V, ensuring seamless communication in your automotive systems. Experience the value and advantages of Texas Instruments' expertise in interface circuits, as they continue to deliver innovative solutions for your networking needs. Choose TLIN10285DRBRQ1 and drive towards connectivity excellence.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material ensures durability and resistance to damage, making it an excellent choice for network interfaces in various environments.

Surface Mount

YES. With the ability to be mounted directly onto the surface of a circuit board, installation and assembly become much easier, enhancing the versatility and efficiency of this network interface.

No. of Functions

1. The presence of a single function simplifies the design and integration process, allowing for a more streamlined and compact product.

Screening Level

AEC-Q100. This stringent screening level guarantees that the network interface meets automotive industry standards, ensuring reliable performance and suitability for automotive applications.

Package Shape

SQUARE. The square shape of this network interface facilitates efficient space utilization on a circuit board, making it an optimal choice for applications where board space is limited.

No. of Terminals

8. With a sufficient number of terminals, this network interface offers enhanced connectivity options, enabling seamless integration into various systems.

Package Style (Meter)

SMALL OUTLINE. The small outline package style ensures a compact design, making it suitable for devices with size constraints without compromising on performance.

Maximum Operating Temperature

125 °C. The network interface's ability to operate at high temperatures makes it reliable in demanding environments, providing stability and consistent performance.

Minimum Operating Temperature

40 °C. With a wide temperature range, this network interface can operate in extreme cold conditions, making it well-suited for a diverse range of environments.

Terminal Finish

NICKEL PALLADIUM GOLD. The use of this terminal finish enhances the network interface's resistance to corrosion, ensuring long-term reliability and durability.

Terminal Position

DUAL. The dual terminal position allows for a flexible and easy connection, providing options for different installation orientations and enhancing the versatility of this network interface.

Maximum Time At Peak Reflow Temperature (s)

30. The network interface's capability to withstand high temperatures for a specific duration enables efficient soldering and manufacturing processes, contributing to its overall reliability.

Peak Reflow Temperature

260 °C. Withstanding peak reflow temperatures ensures optimal soldering during manufacturing, preventing any damage or performance degradation in the network interface.

Temperature Grade

AUTOMOTIVE. Designed for automotive applications, this network interface meets the required temperature standards and is capable of withstanding the challenging conditions often encountered in automotive environments.

No. of Channels

1. Featuring a single channel, this network interface provides a reliable and dedicated connection, simplifying signal transmission and reducing interference.

Terminal Form

NO LEAD. The absence of lead in the terminal form aligns with environmental regulations, ensuring a more eco-friendly product and eliminating any potential health hazards.

Telecom IC Type

INTERFACE CIRCUIT. With its specific telecom IC type, this network interface efficiently manages and handles telecommunication signals, making it an ideal choice for communication-based applications.

Nominal Supply Voltage

12 V. The network interface's ability to operate at a nominal voltage of 12 V ensures compatibility with standard power supplies, simplifying integration into various systems.

Data Rate

0.02 Mbps. Offering a data rate of 0.02 Mbps, this network interface provides a reliable and efficient data transmission capability, making it suitable for low-speed applications.

Moisture Sensitivity Level (MSL)

2. Featuring a moisture sensitivity level of 2, this network interface is designed to withstand moderate moisture exposure, ensuring consistent performance and reliability even in humid environments.

Technical Specifications

Network Interfaces TLIN10285DRBRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

.02 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TLIN10285DRBRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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