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TLC7733QPWRG4

Texas Instruments

TLC7733QPWRG4 by Texas Instruments

TLC7733QPWRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2-6 V and low current consumption of 0.016 mA, suitable for automotive applications. The IC features CMOS technology, Gull Wing terminal form, and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,939 parts In-Stock

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8,939

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 434 parts In-Stock

1+ parts

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434

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Nova Conductors

Japan . 81 parts In-Stock

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81

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 502 parts In-Stock

1+ parts

$4.500

100+ parts

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502

$4.500

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One Stop Electronics

USA . 1,565 parts In-Stock

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$5.500

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1,565

$5.500

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Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$6.208

100+ parts

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$6.969

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1,800

$6.208

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$6.969

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DigiPath Technology Company

USA . 1,181 parts In-Stock

1+ parts

$6.836

100+ parts

$6.289

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1,181

$6.836

$6.289

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ChromeModa Solutions

Germany . 2,869 parts In-Stock

1+ parts

$6.975

100+ parts

$5.720

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2,869

$6.975

$5.720

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IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$6.975

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$6.278

10k+ parts

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2,250

$6.975

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$6.278

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AZTECH Wire

Italy . 333 parts In-Stock

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$15.047

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333

$15.047

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A-Z Elektronik GmbH

Germany . 6,995 parts In-Stock

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6,995

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Continental Prestige Electronics

USA . 6,407 parts In-Stock

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6,407

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Argo Parts USA

USA . 3,100 parts In-Stock

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Microchip USA

USA . 2,639 parts In-Stock

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2,639

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Corphita

USA . 1,955 parts In-Stock

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1,955

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Bastille Electronics

Australia . 36 parts In-Stock

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36

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Overview

Enhance your power management solutions with the TLC7733QPWRG4 by Texas Instruments. Designed with quality and precision in mind, this Power Management IC offers unparalleled reliability and efficiency. Whether for automotive applications or industrial use, this product ensures your systems run smoothly and efficiently. Trust Texas Instruments, a leading manufacturer in the industry, to deliver cutting-edge technology that meets your needs. Upgrade your power management capabilities today with the TLC7733QPWRG4 and experience the difference in performance and value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable construction for the product, ensuring reliability in different operating conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

Supports a common voltage level, making it compatible with a wide range of applications and systems.

No. of Terminals: 8

Provides multiple connection points for versatile integration and functionality within a circuit.

Maximum Operating Temperature: 125 °C

Ensures reliability and performance even in high-temperature environments, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in diverse environmental conditions.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, enhancing overall efficiency and performance.

Technical Specifications

Power Management ICs TLC7733QPWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TLC7733QPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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