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TLC7705QPW

Texas Instruments

TLC7705QPW by Texas Instruments

TLC7705QPW by Texas Instruments is a Power Management IC with Vsup of 2.7V, Isup of 0.016mA, and V threshold of +4.55V. It is used in automotive applications for power supply support circuits due to its compact size, wide operating temperature range (-40 to 125 °C), and low supply voltage requirement (2V).

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,538 parts In-Stock

1+ parts

-

100+ parts

$1.680

1k+ parts

$1.390

10k+ parts

$1.240

10,538

-

$1.680

$1.390

$1.240

DigiKey

USA . 10,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.100

10k+ parts

-

10,538

-

-

$2.100

-

Verical

USA . 3,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.550

3,150

-

-

$1.738

$1.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,222 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

-

10k+ parts

-

3,222

$1.188

-

-

-

DigiKey Marketplace

USA . 10,538 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

-

10k+ parts

-

10,538

-

$1.250

-

-

Vyrian

USA . 4,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,330

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,655 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

7,655

$1.060

-

-

-

Corphita

USA . 1,586 parts In-Stock

1+ parts

$1.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

$1.125

-

-

-

Component Stockers USA

USA . 7,696 parts In-Stock

1+ parts

$1.220

100+ parts

$1.150

1k+ parts

$1.040

10k+ parts

$1.040

7,696

$1.220

$1.150

$1.040

$1.040

Parana Technologies

USA . 1,404 parts In-Stock

1+ parts

$8.472

100+ parts

$786.745

1k+ parts

$7.625

10k+ parts

-

1,404

$8.472

$786.745

$7.625

-

DigiPath Technology Company

USA . 751 parts In-Stock

1+ parts

$9.329

100+ parts

$8.582

1k+ parts

-

10k+ parts

-

751

$9.329

$8.582

-

-

ChromeModa Solutions

Germany . 5,918 parts In-Stock

1+ parts

$9.519

100+ parts

$7.806

1k+ parts

-

10k+ parts

-

5,918

$9.519

$7.806

-

-

IDEA Electronic Components Group

UK . 1,634 parts In-Stock

1+ parts

$9.519

100+ parts

$9.043

1k+ parts

$8.567

10k+ parts

-

1,634

$9.519

$9.043

$8.567

-

Microchip USA

USA . 8,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,796

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Perfect Parts

USA . 571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

571

-

-

-

-

Overview

Discover the ultimate in power management with the TLC7705QPW by Texas Instruments. Designed with precision and quality in mind, this versatile Power Management IC offers unrivaled performance and reliability for a wide range of applications. With a compact design and advanced technology, this IC provides a seamless power supply support circuit that ensures optimal functionality in any environment. Trust Texas Instruments to deliver exceptional value, benefits, and advantages to customers seeking cutting-edge solutions for their power management needs. Elevate your projects with the TLC7705QPW and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power Management IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 2.7 V

Optimal voltage level that is compatible with a wide range of electronic devices, ensuring versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design that saves space on the circuit board, ideal for devices with limited real estate.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh environmental conditions typically found in automotive applications, ensuring reliable performance.

Technology: CMOS

Low power consumption and high noise immunity characteristics of CMOS technology enhance the efficiency and reliability of the Power Management IC.

Technical Specifications

Power Management ICs TLC7705QPW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TLC7705QPW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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