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TLC7705IPWRG4

Texas Instruments

TLC7705IPWRG4 by Texas Instruments

TLC7705IPWRG4 by Texas Instruments is a Power Management IC with Vsup range of 2-6V, operating temp -40 to 85°C. It has 8 terminals, BICMOS technology, and supports power supply circuits. Ideal for industrial applications requiring a compact design with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,642 parts In-Stock

1+ parts

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5,642

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Digiode

USA . 480 parts In-Stock

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480

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,409 parts In-Stock

1+ parts

$0.500

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1,409

$0.500

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One Stop Electronics

USA . 1,008 parts In-Stock

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$0.500

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1,008

$0.500

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Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$10.564

100+ parts

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$11.064

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1,935

$10.564

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$11.064

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AZTECH Wire

Italy . 496 parts In-Stock

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$11.179

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496

$11.179

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DigiPath Technology Company

USA . 1,232 parts In-Stock

1+ parts

$11.633

100+ parts

$10.702

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1,232

$11.633

$10.702

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ChromeModa Solutions

Germany . 2,570 parts In-Stock

1+ parts

$11.870

100+ parts

$9.733

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2,570

$11.870

$9.733

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

1+ parts

$11.870

100+ parts

$11.276

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$10.683

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1,052

$11.870

$11.276

$10.683

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QUARKTWIN TECHNOLOGY LTD

USA . 8,696 parts In-Stock

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8,696

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A-Z Elektronik GmbH

Germany . 6,908 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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Microchip USA

USA . 2,971 parts In-Stock

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Corphita

USA . 1,780 parts In-Stock

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1,780

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Metaverse IC Inc.

Canada . 1,207 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TLC7705IPWRG4 Power Management IC. This versatile component is designed to meet the demands of industrial applications, offering a wide supply voltage range and minimal power consumption for optimal performance. With its compact size and advanced technology, this IC provides exceptional value and efficiency, making it the ideal choice for your power supply support circuit needs. Trust in Texas Instruments to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the Power Management IC, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable makes the IC easy to integrate into circuit boards, allowing for efficient assembly and saving space.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage of 2.7V ensures compatibility with a wide range of applications and power sources.

Number of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to various components, enabling versatile power management capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can handle demanding conditions and maintain optimal performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the IC can function effectively in a wide range of environments, including cold temperatures.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of bipolar and CMOS transistors, leading to improved efficiency, speed, and reliability in power management.

Technical Specifications

Power Management ICs TLC7705IPWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TLC7705IPWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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