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TLC7703IDG4

Texas Instruments

TLC7703IDG4 by Texas Instruments

TLC7703IDG4 by Texas Instruments is a Power Management IC with Vsup range of 2-6V, operating temp -40 to 85°C. It features BICMOS technology, GULL WING terminals, and supports power supply circuits. Ideal for industrial applications requiring low supply current and small outline package design.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 464 parts In-Stock

1+ parts

$1.140

100+ parts

$1.120

1k+ parts

$1.090

10k+ parts

-

464

$1.140

$1.120

$1.090

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,283 parts In-Stock

1+ parts

-

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6,283

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Digiode

USA . 3,367 parts In-Stock

1+ parts

-

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3,367

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-

-

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Sea View Technologies

USA . 100 parts In-Stock

1+ parts

-

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100

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-

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

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50

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 941 parts In-Stock

1+ parts

$2.500

100+ parts

-

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941

$2.500

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-

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Parana Technologies

USA . 1,119 parts In-Stock

1+ parts

$3.331

100+ parts

-

1k+ parts

$3.854

10k+ parts

-

1,119

$3.331

-

$3.854

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DigiPath Technology Company

USA . 1,566 parts In-Stock

1+ parts

$3.668

100+ parts

$3.375

1k+ parts

-

10k+ parts

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1,566

$3.668

$3.375

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ChromeModa Solutions

Germany . 3,505 parts In-Stock

1+ parts

$3.743

100+ parts

$3.069

1k+ parts

-

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3,505

$3.743

$3.069

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IDEA Electronic Components Group

UK . 956 parts In-Stock

1+ parts

$3.743

100+ parts

-

1k+ parts

$3.369

10k+ parts

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956

$3.743

-

$3.369

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One Stop Electronics

USA . 989 parts In-Stock

1+ parts

$5.500

100+ parts

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989

$5.500

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AZTECH Wire

Italy . 729 parts In-Stock

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$19.555

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729

$19.555

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Continental Prestige Electronics

USA . 6,613 parts In-Stock

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Microchip USA

USA . 2,129 parts In-Stock

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2,129

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,277 parts In-Stock

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1,277

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Corphita

USA . 1,037 parts In-Stock

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1,037

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Overview

Enhance your power management capabilities with the TLC7703IDG4 by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers reliable Power Management ICs that are essential for a wide range of applications. This small outline package offers customers a convenient and efficient solution, with a nominal supply voltage of 2.7V and a temperature grade of industrial. Trust in Texas Instruments to provide you with the best technology and performance in power supply support circuits. Experience the value and benefits that the TLC7703IDG4 can bring to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 2.7 V

Ideal voltage level for powering the IC and ensuring optimal performance.

No. of Terminals: 8

Sufficient number of terminals for connecting external components and interfacing with the system.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperature conditions as well, ensuring reliable performance in various environments.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: GULL WING

Facilitates easy soldering during assembly, improving the overall reliability of the connection.

Technical Specifications

Power Management ICs TLC7703IDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TLC7703IDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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