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TLC7701QPWREP

Texas Instruments

TLC7701QPWREP by Texas Instruments

TLC7701QPWREP by Texas Instruments is a Power Management IC with Vsup ranging from 2V to 6V. It features a small outline package, dual terminal position, and operates in automotive temperature grade. Ideal for power supply support circuits, it has a max seated height of 1.2mm and peak reflow temperature of 260°C.

Median Price

$5.466

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 771 parts In-Stock

1+ parts

$5.466

100+ parts

$2.368

1k+ parts

$2.241

10k+ parts

-

771

$5.466

$2.368

$2.241

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Vyrian

USA . 5,860 parts In-Stock

1+ parts

-

100+ parts

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5,860

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Chip Stock

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Digiode

USA . 1,757 parts In-Stock

1+ parts

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1,757

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ACDS - Activité Composants Distribution Service

France . 779 parts In-Stock

1+ parts

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779

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Dan-Mar Components

USA . 771 parts In-Stock

1+ parts

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771

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Nova Conductors

Japan . 59 parts In-Stock

1+ parts

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,301 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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10k+ parts

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1,301

$0.500

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-

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Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$1.503

100+ parts

$139.596

1k+ parts

$1.353

10k+ parts

-

1,562

$1.503

$139.596

$1.353

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DigiPath Technology Company

USA . 1,216 parts In-Stock

1+ parts

$1.655

100+ parts

-

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10k+ parts

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1,216

$1.655

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ChromeModa Solutions

Germany . 1,299 parts In-Stock

1+ parts

$1.689

100+ parts

$1.385

1k+ parts

-

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1,299

$1.689

$1.385

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IDEA Electronic Components Group

UK . 19 parts In-Stock

1+ parts

$1.689

100+ parts

-

1k+ parts

$1.520

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19

$1.689

-

$1.520

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Ampacity Inc.

Singapore . 509 parts In-Stock

1+ parts

$3.500

100+ parts

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1k+ parts

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509

$3.500

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Advanced Electronics

New Zealand . 4,489 parts In-Stock

1+ parts

$9.885

100+ parts

$8.995

1k+ parts

$8.106

10k+ parts

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4,489

$9.885

$8.995

$8.106

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Microchip USA

USA . 1,710 parts In-Stock

1+ parts

$17.030

100+ parts

$16.920

1k+ parts

$16.870

10k+ parts

$16.820

1,710

$17.030

$16.920

$16.870

$16.820

AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$19.665

100+ parts

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581

$19.665

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Continental Prestige Electronics

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Corphita

USA . 2,468 parts In-Stock

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2,468

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Argo Parts USA

USA . 1,580 parts In-Stock

1+ parts

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1,580

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Bastille Electronics

Australia . 60 parts In-Stock

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60

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Overview

Elevate your power management game with the TLC7701QPWREP by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This power management IC is designed to provide optimal performance and reliability in various applications. With its compact package shape, versatile terminal positions, and wide operating temperature range, this product offers unmatched value and benefits to customers looking for efficient power supply support circuits. Upgrade your systems today with the TLC7701QPWREP and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is typically lightweight and durable, making the product suitable for various applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling efficient assembly processes.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage of 2.7 V indicates that this power management IC is designed to operate within this voltage range, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the power management IC can withstand elevated temperature environments, making it suitable for use in various industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the product.

Temperature Grade: AUTOMOTIVE

Being automotive grade signifies that the power management IC meets stringent quality and reliability standards required for automotive applications, ensuring optimal performance in automotive electronics.

Technical Specifications

Power Management ICs TLC7701QPWREP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.1V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TLC7701QPWREP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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