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TLC5615CDGKRG4

Texas Instruments

TLC5615CDGKRG4 by Texas Instruments

TLC5615CDGKRG4 by Texas Instruments is a 10-bit DAC with max output voltage of 5.1V, linearity error of 0.0977%, and settling time of 12.5us. Ideal for applications requiring precise analog signal generation in commercial temperature range, it features serial input format and low supply current of 0.35mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,387 parts In-Stock

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Digiode

USA . 1,607 parts In-Stock

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1,607

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Distributors (Availability)

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AZTECH Wire

Italy . 830 parts In-Stock

1+ parts

$6.460

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830

$6.460

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Parana Technologies

USA . 502 parts In-Stock

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$9.343

100+ parts

$867.660

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$8.409

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502

$9.343

$867.660

$8.409

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DigiPath Technology Company

USA . 805 parts In-Stock

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$10.288

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805

$10.288

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

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$10.498

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$9.973

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$9.448

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1,997

$10.498

$9.973

$9.448

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ChromeModa Solutions

Germany . 1,443 parts In-Stock

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$10.498

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$8.608

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1,443

$10.498

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One Stop Electronics

USA . 355 parts In-Stock

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$15.000

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355

$15.000

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Corphita

USA . 1,606 parts In-Stock

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Overview

Unlock the power of precision with the TLC5615CDGKRG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments delivers top-notch quality and reliability in every product. Ideal for a wide range of applications, this D/A converter offers customers unmatched value and benefits. Experience seamless performance and superior output voltage control, all in a compact and durable package. Trust Texas Instruments to elevate your projects to new heights of excellence.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

High maximum analog output voltage allows for a wide range of output signals, suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product.

No. of Bits: 10

With 10 bits, this digital-to-analog converter provides high precision and accuracy in converting digital signals to analog output.

Nominal Settling Time (tstl): 12.5 us

Fast settling time ensures quick response and stability in generating analog output signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter efficient and reliable.

Technical Specifications

Digital-to-Analog Converters TLC5615CDGKRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

12.5 µs

Maximum Supply Current:

350 μA

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

Trade Compliance

TLC5615CDGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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