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TLC5602CDWG4

Texas Instruments

TLC5602CDWG4 by Texas Instruments

TLC5602CDWG4 by Texas Instruments is an 8-bit DAC with max output voltage of 5.265V, 0.2% linearity error, and settling time of 0.03us. Ideal for applications requiring precise analog signal generation in commercial temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,140 parts In-Stock

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8,140

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Digiode

USA . 2,405 parts In-Stock

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2,405

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Bristol Electronics

USA . 475 parts In-Stock

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475

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EMSNET

USA . 87 parts In-Stock

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87

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,118 parts In-Stock

1+ parts

$4.000

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1,118

$4.000

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Parana Technologies

USA . 1,551 parts In-Stock

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$9.225

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$9.865

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1,551

$9.225

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$9.865

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DigiPath Technology Company

USA . 1,092 parts In-Stock

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$10.158

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$9.345

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1,092

$10.158

$9.345

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ChromeModa Solutions

Germany . 3,405 parts In-Stock

1+ parts

$10.365

100+ parts

$8.499

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3,405

$10.365

$8.499

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IDEA Electronic Components Group

UK . 631 parts In-Stock

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$10.365

100+ parts

$9.847

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$9.328

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631

$10.365

$9.847

$9.328

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AZTECH Wire

Italy . 362 parts In-Stock

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$14.175

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362

$14.175

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Corphita

USA . 1,528 parts In-Stock

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1,528

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Overview

Experience unparalleled precision and reliability with the TLC5602CDWG4 by Texas Instruments. As a leader in the industry, Texas Instruments sets the standard for quality digital-to-analog converters. This versatile product is perfect for a wide range of applications, providing customers with seamless integration and exceptional performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and brings value to your projects. Elevate your designs with the TLC5602CDWG4 and unlock endless possibilities.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.265 V

Provides a high maximum output voltage to ensure compatibility with a wide range of systems and peripherals.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient.

No. of Bits: 8

Provides high resolution and accuracy for digital-to-analog conversion.

Maximum Linearity Error (EL): 0.2%

Ensures accurate and reliable conversion with minimal error.

Power Supplies (V): 5

Operates efficiently with a standard 5V power supply.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for versatile installation.

Nominal Settling Time (tstl): 0.03 us

Fast settling time ensures quick and precise output after input changes.

Maximum Operating Temperature: 70 °C

Capable of operating at a relatively high temperature range for increased versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Digital-to-Analog Converters TLC5602CDWG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.2 %

Nominal Settling Time (tstl):

30 ns

Maximum Supply Current:

25 mA

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

4.735 V

Maximum Analog Output Voltage:

5.265 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Trade Compliance

TLC5602CDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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