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TLC5602ADW

Texas Instruments

TLC5602ADW by Texas Instruments

TLC5602ADW by Texas Instruments is an 8-bit D/A converter with 0.2% linearity error and 0.03 us settling time. Ideal for commercial applications, it operates at temperatures ranging from 0 to 70 °C, with a supply voltage of 5 V. The compact rectangular package is surface mountable and features a dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,782 parts In-Stock

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8,782

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Digiode

USA . 2,239 parts In-Stock

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2,239

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$5.024

100+ parts

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221

$5.024

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Parana Technologies

USA . 1,021 parts In-Stock

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$12.156

100+ parts

-

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$12.568

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1,021

$12.156

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$12.568

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DigiPath Technology Company

USA . 563 parts In-Stock

1+ parts

$13.385

100+ parts

$12.314

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563

$13.385

$12.314

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ChromeModa Solutions

Germany . 3,949 parts In-Stock

1+ parts

$13.658

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$11.200

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3,949

$13.658

$11.200

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IDEA Electronic Components Group

UK . 1,085 parts In-Stock

1+ parts

$13.658

100+ parts

$12.975

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$12.292

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1,085

$13.658

$12.975

$12.292

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One Stop Electronics

USA . 1,467 parts In-Stock

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$26.000

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1,467

$26.000

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Corphita

USA . 1,184 parts In-Stock

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Overview

Unlock new possibilities with the TLC5602ADW by Texas Instruments, a high-quality Digital-to-Analog Converter designed to meet your needs. From its reliable manufacturer to its versatile applications in various industries, this product offers unparalleled value and benefits. Experience precision and efficiency like never before with the TLC5602ADW, making it the perfect choice for your next project. Elevate your designs with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

No. of Bits: 8

Having 8 bits allows for a higher resolution and more accurate conversion of digital signals to analog, providing better performance.

Maximum Linearity Error (EL): 0.2%

With a low linearity error, this converter ensures accurate conversion and minimal distortion, resulting in high-quality analog output.

Nominal Settling Time (tstl): 0.03 us

The fast settling time ensures that the converter quickly stabilizes the output voltage after a change in the input signal, improving efficiency.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes this converter compatible with a wide range of systems and easy to integrate.

Technical Specifications

Digital-to-Analog Converters TLC5602ADW attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Input Format:

Parallel, 8 Bits

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.2 %

Nominal Settling Time (tstl):

30 ns

Maximum Supply Current:

25 mA

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLC5602ADW Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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