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TLC5620CDRG4

Texas Instruments

TLC5620CDRG4 by Texas Instruments

TLC5620CDRG4 by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of 7V and settling time of 10us. Ideal for applications requiring precise voltage outputs, it operates at temperatures from 0 to 70°C and has a sample rate of 0.048MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,482 parts In-Stock

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5,482

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Digiode

USA . 4,721 parts In-Stock

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4,721

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Chip Stock

USA . 3,980 parts In-Stock

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3,980

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Nova Conductors

Japan . 91 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

$4.458

100+ parts

$413.994

1k+ parts

$4.012

10k+ parts

-

1,569

$4.458

$413.994

$4.012

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DigiPath Technology Company

USA . 943 parts In-Stock

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$4.909

100+ parts

$4.516

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943

$4.909

$4.516

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ChromeModa Solutions

Germany . 3,444 parts In-Stock

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$5.009

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$4.107

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3,444

$5.009

$4.107

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IDEA Electronic Components Group

UK . 517 parts In-Stock

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$5.009

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$4.508

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517

$5.009

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$4.508

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AZTECH Wire

Italy . 465 parts In-Stock

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$12.599

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465

$12.599

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Ampacity Inc.

Singapore . 1,255 parts In-Stock

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$13.000

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$13.000

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One Stop Electronics

USA . 399 parts In-Stock

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$15.000

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399

$15.000

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Argo Parts USA

USA . 4,794 parts In-Stock

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Corphita

USA . 4,680 parts In-Stock

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4,680

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Continental Prestige Electronics

USA . 2,135 parts In-Stock

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Microchip USA

USA . 989 parts In-Stock

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989

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Overview

Elevate your digital-to-analog conversion experience with the TLC5620CDRG4 by Texas Instruments. As a reputable manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile D/A converter offers a maximum analog output voltage of 7V and a settling time of just 10 microseconds, making it ideal for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or telecommunications, this compact and efficient device delivers exceptional performance. Experience the value and benefits of seamless analog signal conversion with the TLC5620CDRG4.

Feature Benefit Bullets

Maximum Analog Output Voltage: 7 V

High maximum analog output voltage allows for a wide range of output signal levels, making this product versatile for different applications.

No. of Bits: 8

With 8 bits, this digital-to-analog converter provides good resolution and accuracy for converting digital signals to analog output.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and accurate output, particularly important for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various environments.

Input Format: SERIAL

Serial input format allows for easy interfacing with digital systems, enhancing compatibility and flexibility in integration.

Technical Specifications

Digital-to-Analog Converters TLC5620CDRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.3906 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

2 mA

Maximum Settling Time:

10 µs

Sample Rate:

48 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

7 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

14

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.905 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Trade Compliance

TLC5620CDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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