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TLC556CN1

Texas Instruments

TLC556CN1 by Texas Instruments

TLC556CN1 by Texas Instruments is an Analog Waveform Generation IC with 14 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 5/18V and uses CMOS technology. Ideal for applications requiring precise waveform generation in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,020 parts In-Stock

1+ parts

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100+ parts

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5,020

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Digiode

USA . 1,053 parts In-Stock

1+ parts

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1,053

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,522 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,522

$5.500

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Ampacity Inc.

Singapore . 933 parts In-Stock

1+ parts

$6.500

100+ parts

-

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933

$6.500

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Semicontronic

India . 816 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

816

$7.500

$7.312

$7.275

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Parana Technologies

USA . 2,037 parts In-Stock

1+ parts

$7.604

100+ parts

-

1k+ parts

$8.115

10k+ parts

-

2,037

$7.604

-

$8.115

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ChromeModa Solutions

Germany . 2,985 parts In-Stock

1+ parts

$8.544

100+ parts

$7.006

1k+ parts

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2,985

$8.544

$7.006

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IDEA Electronic Components Group

UK . 1,602 parts In-Stock

1+ parts

$8.544

100+ parts

$8.117

1k+ parts

$7.690

10k+ parts

-

1,602

$8.544

$8.117

$7.690

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$17.574

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696

$17.574

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DigiPath Technology Company

USA . 1,874 parts In-Stock

1+ parts

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$7.703

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1,874

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$7.703

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Corphita

USA . 508 parts In-Stock

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508

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Corohmni

South Africa . 262 parts In-Stock

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262

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Overview

Experience the unmatched quality and precision of Texas Instruments with the TLC556CN1 Analog Waveform Generator. This versatile component offers a wide range of applications, providing customers with endless possibilities for their projects. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers reliable performance and durability. Take your designs to the next level with the TLC556CN1, offering value, efficiency, and innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and resistant to corrosion, making the product suitable for various environments and applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into electronic circuits and systems, maximizing space efficiency.

Power Supplies (V): 5/18

The product can operate with a range of power supplies, offering flexibility and compatibility with different systems.

No. of Terminals: 14

With a sufficient number of terminals, the product can support multiple connections and functions, enhancing its versatility.

Package Style (Meter): IN-LINE

The in-line package style enables easy installation and connection to other components, simplifying the overall setup process.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, improving the product's durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in a wide range of ambient temperatures.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting the product, increasing reliability and ease of use.

Temperature Grade: COMMERCIAL

Designed for commercial applications, the product meets industry standards for performance and reliability in typical operating environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with digital systems, enhancing the product's efficiency and reliability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering and assembly process, ensuring secure connections and long-term stability.

Terminal Pitch: 2.54 mm

With a standard terminal pitch, the product can be easily integrated into existing circuits and PCB layouts, enabling quick and convenient installation.

Technical Specifications

Analog Waveform Generation TLC556CN1 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/18

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC556CN1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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