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LM556CN

Texas Instruments

LM556CN by Texas Instruments

LM556CN by Texas Instruments is a dual-function analog waveform generator with a nominal voltage of 5V and power supplies of 5/15V. It operates in commercial temperature grade range from 0 to 70°C, making it suitable for various pulse and rectangular waveform generation applications. With through-hole terminal form and rectangular package shape, it offers versatility in electronic circuit designs.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

55

In-Stock Inventory

1k+

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Adafruit Industries

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DF Sales Co.

USA . 11 parts In-Stock

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Component Electronics Inc.

Canada . 4 parts In-Stock

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$3.850

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Forefront Electronics and Design

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 28 parts In-Stock

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$5.500

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$5.362

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$5.335

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Corohmni

South Africa . 1,021 parts In-Stock

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$10.353

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Parana Technologies

USA . 1,671 parts In-Stock

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$17.067

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$17.289

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AZTECH Wire

Italy . 773 parts In-Stock

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$18.538

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$18.538

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DigiPath Technology Company

USA . 733 parts In-Stock

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$18.792

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$17.289

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ChromeModa Solutions

Germany . 5,577 parts In-Stock

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$19.176

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$15.724

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IDEA Electronic Components Group

UK . 530 parts In-Stock

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$19.176

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$18.217

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$17.258

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$19.176

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Aztec Data Supply Inc.

USA . 4,668 parts In-Stock

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$19.959

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Component Stockers USA

USA . 632 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 8,396 parts In-Stock

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Continental Prestige Electronics

USA . 6,729 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 4,543 parts In-Stock

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Argo Parts USA

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Overview

Unlock the power of analog waveform generation with the LM556CN by Texas Instruments. Crafted with precision and expertise, this versatile component offers double the functionality in a compact rectangular package. Ideal for a wide range of applications, this innovative product delivers reliable performance and unmatched quality. Experience seamless integration and enhanced efficiency with the LM556CN, designed to meet your every need with ease. Elevate your projects with Texas Instruments' commitment to excellence and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external environmental factors, ensuring the longevity of the product.

No. of Functions: 2

Having multiple functions in a single product provides versatility and flexibility in waveform generation, allowing for a broader range of applications.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power supplies, making it easy to integrate this product into existing systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the product to operate reliably in a wide range of environmental conditions.

Technology: BIPOLAR

The use of bipolar technology ensures accurate and stable waveform generation, leading to high-quality output signals for various applications.

Technical Specifications

Analog Waveform Generation LM556CN attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Length:

19.18 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

LM556CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-085-4174, 5962010854174, 5962-01-310-0383, 5962013100383

NIIN

010854174, 013100383

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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