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TLC551CPE4

Texas Instruments

TLC551CPE4 by Texas Instruments

TLC551CPE4 by Texas Instruments is an Analog Waveform Generation IC with 1.2 GHz max output frequency, 5 V nominal voltage, and 0.5 mA max supply current. It is ideal for pulse generation applications in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,134 parts In-Stock

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Chip Stock

USA . 3,066 parts In-Stock

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3,066

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Digiode

USA . 1,388 parts In-Stock

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1,388

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Distributors (Availability)

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One Stop Electronics

USA . 1,313 parts In-Stock

1+ parts

$0.500

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1,313

$0.500

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Semicontronic

India . 1,436 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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1,436

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 915 parts In-Stock

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$6.500

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915

$6.500

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Parana Technologies

USA . 927 parts In-Stock

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$15.390

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$15.776

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927

$15.390

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$15.776

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AZTECH Wire

Italy . 812 parts In-Stock

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$15.483

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812

$15.483

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DigiPath Technology Company

USA . 1,129 parts In-Stock

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$16.946

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$15.590

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1,129

$16.946

$15.590

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ChromeModa Solutions

Germany . 4,310 parts In-Stock

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$17.292

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$14.179

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$17.292

$14.179

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IDEA Electronic Components Group

UK . 266 parts In-Stock

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$17.292

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$16.427

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$15.563

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266

$17.292

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$15.563

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Corphita

USA . 496 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Enhance your circuit design with the TLC551CPE4 by Texas Instruments, a top-quality analog waveform generation IC that offers unparalleled reliability and performance. Known for their cutting-edge technology and superior manufacturing processes, Texas Instruments delivers innovative solutions for a wide range of applications. From pulse generation to rectangular waveforms, this versatile component provides precise outputs at a wide frequency range. Experience the value of seamless integration, enhanced functionality, and consistent results with the TLC551CPE4 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V is a common and widely available power source, making it easy to integrate this product into existing systems.

Maximum Output Frequency: 1.2 GHz

The high maximum output frequency of 1.2 GHz allows for the generation of complex waveforms with high precision and detail.

Power Supplies (V): 1/15

The product supports a wide range of power supply voltages, providing flexibility for different system requirements.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into circuits and systems, saving space and facilitating assembly.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance within typical operating conditions, making the product suitable for most commercial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections, reducing the risk of signal loss or interference.

Technical Specifications

Analog Waveform Generation TLC551CPE4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

1/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TLC551CPE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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