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SE556CFK

Texas Instruments

SE556CFK by Texas Instruments

SE556CFK by Texas Instruments is a dual-function analog waveform generator with 20 terminals. It operates b/w -55 to 125 °C and supports supply voltages of 4.5-16 V, drawing a max current of 30 mA. Ideal for military-grade applications requiring pulse and rectangular waveforms in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,786 parts In-Stock

1+ parts

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4,786

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Digiode

USA . 3,865 parts In-Stock

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3,865

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Distributors (Availability)

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One Stop Electronics

USA . 526 parts In-Stock

1+ parts

$1.500

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526

$1.500

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Semicontronic

India . 1,206 parts In-Stock

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$2.500

100+ parts

$2.438

1k+ parts

$2.425

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1,206

$2.500

$2.438

$2.425

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Parana Technologies

USA . 2,320 parts In-Stock

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$6.012

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$6.788

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2,320

$6.012

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$6.788

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$6.620

100+ parts

$6.090

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1,265

$6.620

$6.090

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AZTECH Wire

Italy . 437 parts In-Stock

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$6.743

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437

$6.743

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$6.755

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$6.080

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2,266

$6.755

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$6.080

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ChromeModa Solutions

Germany . 1,068 parts In-Stock

1+ parts

$6.755

100+ parts

$5.539

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1,068

$6.755

$5.539

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Ampacity Inc.

Singapore . 1,509 parts In-Stock

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$7.500

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1,509

$7.500

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Corphita

USA . 2,934 parts In-Stock

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2,934

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Elevate your analog waveform generation with the SE556CFK by Texas Instruments. Renowned for their high-quality products, Texas Instruments brings you a versatile solution for a wide range of applications. This dual-function chip carrier offers superior performance and reliability, making it an essential tool for any electronics enthusiast. Experience the value and benefits of this innovative product, designed to enhance your projects with precision and efficiency. Upgrade your analog waveform generation capabilities today with the Texas Instruments SE556CFK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

No. of Functions: 2

Provides versatility and capability to generate multiple waveforms.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage for compatibility with various systems.

Power Supplies (V): 5/15

Offers flexibility in power options to suit different requirements.

No. of Terminals: 20

Sufficient connectivity for versatile applications.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -55 °C

Suitable for use in a wide range of temperature conditions.

Package Style (Meter): CHIP CARRIER

Compact and efficient design for space-constrained applications.

Technology: BIPOLAR

Provides stable performance and reliable signal generation.

Technical Specifications

Analog Waveform Generation SE556CFK attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.89 mm

Trade Compliance

SE556CFK Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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