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SE556CN

NXP Semiconductors

SE556CN by NXP Semiconductors

SE556CN by NXP Semiconductors is a dual-function analog waveform generator designed for military applications. It operates b/w -55 °C to 125 °C, with a supply voltage range of 4.5V to 16V and a max current of 30mA. Its compact in-line package features 14 terminals for versatile integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,561 parts In-Stock

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4,561

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Digiode

USA . 1,878 parts In-Stock

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1,878

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Anansix

USA . 1,605 parts In-Stock

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1,605

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,030 parts In-Stock

1+ parts

$7.500

100+ parts

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1,030

$7.500

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UNI Independent Distributors

Spain . 7,240 parts In-Stock

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7,240

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Corphita

USA . 459 parts In-Stock

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459

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Overview

Unlock unparalleled performance with the SE556CN from NXP Semiconductors, a trusted leader in innovation. This versatile analog waveform generator excels in diverse applications, ensuring precision and reliability even in extreme conditions. With its robust design and military-grade temperature resilience, it guarantees durability while delivering superior signal quality. Elevate your projects and experience seamless integration, making the SE556CN the smart choice for exceptional value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protection against environmental hazards, making it suitable for various applications.

No. of Functions: 2

Having two functions allows for versatile usage, enabling designers to optimize designs without the need for multiple components.

Package Shape: RECTANGULAR

A rectangular shape facilitates efficient board layout and integration into different circuit designs.

No. of Terminals: 14

With 14 terminals, it offers ample connections for diverse functionalities and easier integration into larger systems.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and connection in both prototyping and production environments.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the component to function reliably in demanding environments.

Minimum Operating Temperature: -55 °C

The ability to operate at very low temperatures makes this product suitable for extreme conditions, including military applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier soldering and PCB design flexibility.

Maximum Seated Height: 4.2 mm

A low seated height aids in reducing the overall profile in compact designs, ideal for space-constrained applications.

Width: 7.62 mm

A relatively narrow width allows for the component to fit in tight spaces on a PCB.

Other IC Type: PULSE

As a pulse IC type, it is well-suited for generating precise pulse signals essential in timing and modulation applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with various power supply levels, accommodating many applications.

Length: 19.025 mm

A length of 19.025 mm provides a compact design without compromising functionality, beneficial for miniaturized applications.

Temperature Grade: MILITARY

With a military grade temperature specification, this product meets stringent reliability requirements for defense and aerospace applications.

Maximum Supply Current (Isup): 30 mA

A maximum supply current of 30 mA empowers powerful signal generation while remaining energy efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminal design offers mechanical robustness during soldering, reducing failure rates in demanding environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm is compatible with a wide range of PCB layouts and designs.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16 V provides flexibility in power supply selection, accommodating a variety of applications.

Technical Specifications

Analog Waveform Generation SE556CN attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SE556CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-217-0217, 5962012170217, 5962-01-270-9066, 5962012709066

NIIN

012170217, 012709066

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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