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TLC2558CPWG4

Texas Instruments

TLC2558CPWG4 by Texas Instruments

TLC2558CPWG4 by Texas Instruments is a 12-bit ADC with 8 analog in channels, 0.0244% max linearity error, and 0.4 MHz sample rate. Ideal for commercial applications requiring precise analog-to-digital conversion in a compact SOT-23 package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,135 parts In-Stock

1+ parts

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5,135

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Digiode

USA . 2,840 parts In-Stock

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2,840

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$18.892

100+ parts

-

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791

$18.892

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One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$20.000

100+ parts

-

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471

$20.000

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Parana Technologies

USA . 2,090 parts In-Stock

1+ parts

$23.708

100+ parts

-

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$24.333

10k+ parts

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2,090

$23.708

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$24.333

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ChromeModa Solutions

Germany . 4,304 parts In-Stock

1+ parts

$26.638

100+ parts

$21.843

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10k+ parts

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4,304

$26.638

$21.843

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

1+ parts

$26.638

100+ parts

$25.306

1k+ parts

$23.974

10k+ parts

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1,716

$26.638

$25.306

$23.974

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Corphita

USA . 2,324 parts In-Stock

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2,324

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Microchip USA

USA . 283 parts In-Stock

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283

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DigiPath Technology Company

USA . 72 parts In-Stock

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$24.017

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72

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$24.017

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Overview

Experience superior quality and precision with the TLC2558CPWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters like no other. This 12-bit ADC offers 8 analog input channels, ensuring accurate and reliable performance in a variety of applications. With a maximum linearity error of just 0.0244%, this device guarantees optimal results every time. Trust Texas Instruments to provide you with exceptional value, benefits, and advantages that will take your projects to the next level. Choose the TLC2558CPWG4 for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

No. of Analog In Channels: 8

Allows for multiple inputs to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Easy to integrate onto circuit boards for compact and space-saving designs.

No. of Bits: 12

High resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.0244 %

Provides precise and consistent conversion results.

Power Supplies (V): 5

Compatible with standard power sources for easy integration.

No. of Terminals: 20

Sufficient connectivity options for versatile applications.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-efficient design for modern electronics.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for reliable performance in various environments.

Technology: CMOS

Low power consumption and high speed operation for efficient processing.

Technical Specifications

Analog-to-Digital Converters TLC2558CPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

400 kHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

Trade Compliance

TLC2558CPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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