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TLC2543MJ

Texas Instruments

TLC2543MJ by Texas Instruments

TLC2543MJ by Texas Instruments is a 12-bit ADC with 11 analog input channels, 0.0244% linearity error, and 10us conversion time. Ideal for military applications due to its MIL temperature grade, it operates on a 5V supply with a max input voltage of 5.5V. The package style is in-line with through-hole terminals, making it suitable for precise data acquisition in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,514 parts In-Stock

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4,514

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Vyrian

USA . 2,911 parts In-Stock

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2,911

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Distributors (Availability)

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One Stop Electronics

USA . 961 parts In-Stock

1+ parts

$9.000

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-

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961

$9.000

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AZTECH Wire

Italy . 393 parts In-Stock

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$10.823

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393

$10.823

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Parana Technologies

USA . 863 parts In-Stock

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$20.942

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$21.147

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863

$20.942

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$21.147

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DigiPath Technology Company

USA . 473 parts In-Stock

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$23.059

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473

$23.059

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

1+ parts

$23.530

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$22.354

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$21.177

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2,143

$23.530

$22.354

$21.177

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ChromeModa Solutions

Germany . 1,843 parts In-Stock

1+ parts

$23.530

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$19.295

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1,843

$23.530

$19.295

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Microchip USA

USA . 4,009 parts In-Stock

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Corphita

USA . 2,132 parts In-Stock

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Overview

Enhance your analog-to-digital conversion needs with the Texas Instruments TLC2543MJ. Renowned for their top-notch quality and cutting-edge technology, Texas Instruments delivers exceptional products like the TLC2543MJ. This versatile ADC converter boasts 11 analog input channels and a maximum linearity error of just 0.0244%, making it perfect for military-grade applications where precision is key. With a compact design and efficient power consumption, the TLC2543MJ offers unmatched value and performance for your projects. Experience the difference with Texas Instruments' superior products today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durable and reliable packaging for the analog-to-digital converter, ensuring longevity and protection from external elements.

No. of Analog In Channels: 11

Allows for multiple input channels to be converted to digital signals simultaneously, enabling versatile usage in various applications.

No. of Bits: 12

Provides high resolution and accuracy in converting analog signals to digital, making it suitable for precision measurement and data acquisition.

Power Supplies (V): 5

Operates on a standard voltage supply, making it easy to integrate into existing systems and circuits.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, which is ideal for battery-powered devices and applications requiring fast conversion rates.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in the output format of the digital signal, allowing compatibility with different systems and processors.

Sample and Hold/Track and Hold: SAMPLE

Incorporates sample and hold functionality for accurate and stable conversion of analog signals, ensuring reliable performance in varying input conditions.

Technical Specifications

Analog-to-Digital Converters TLC2543MJ attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.953 in (24.195 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Ceramic, Glass-Sealed

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP20,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-GDIP-T20

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TLC2543MJ Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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