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TLC1543IDBRG4

Texas Instruments

TLC1543IDBRG4 by Texas Instruments

TLC1543IDBRG4 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% EL, and 5V power supply. Ideal for industrial applications, it offers a sample rate of 0.038 MHz and operates b/w -40 to 85°C. With a small outline package style, it's suitable for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 4,522 parts In-Stock

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Digiode

USA . 3,688 parts In-Stock

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Vyrian

USA . 3,230 parts In-Stock

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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AZTECH Wire

Italy . 398 parts In-Stock

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$8.878

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Parana Technologies

USA . 1,562 parts In-Stock

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$9.704

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$10.286

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DigiPath Technology Company

USA . 525 parts In-Stock

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$10.685

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$9.830

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525

$10.685

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ChromeModa Solutions

Germany . 4,152 parts In-Stock

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$10.903

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$8.940

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IDEA Electronic Components Group

UK . 213 parts In-Stock

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$10.903

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$10.358

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$9.813

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One Stop Electronics

USA . 1,598 parts In-Stock

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$37.000

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Component Stockers USA

USA . 235 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the power of precision with the TLC1543IDBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in analog-to-digital converters. This versatile device offers 10 bits of accuracy across 11 channels, making it ideal for a wide range of applications. From industrial automation to medical equipment, the TLC1543IDBRG4 provides fast conversion times and low power consumption, ensuring optimal performance in any project. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TLC1543IDBRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the ADC, increasing its durability and reliability.

No. of Analog In Channels: 11

With 11 analog input channels, this ADC can handle multiple input signals simultaneously, making it suitable for applications requiring high channel counts.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for compact design integration on circuit boards.

No. of Bits: 10

10-bit resolution provides high accuracy in converting analog signals to digital data, making it ideal for applications that require precise measurements.

Maximum Linearity Error (EL): 0.0977%

Low linearity error ensures accurate representation of input signals in the digital output, making the ADC reliable for sensitive applications.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration with existing systems and reduces design complexity.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to external components and interfacing with the rest of the system.

Package Style: SMALL OUTLINE, SHRINK PITCH

The compact and ergonomic package style offers space-saving benefits and allows for efficient board layout design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing the versatility of the ADC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions and perform reliably in industrial settings.

Technical Specifications

Analog-to-Digital Converters TLC1543IDBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC1543IDBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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