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TLC1542CDWG4

Texas Instruments

TLC1542CDWG4 by Texas Instruments

TLC1542CDWG4 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0488% EL, and 21us conversion time. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments. Package: Small Outline, Surface Mount with Gull Wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,945 parts In-Stock

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6,945

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Digiode

USA . 3,891 parts In-Stock

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3,891

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Distributors (Availability)

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Parana Technologies

USA . 2,136 parts In-Stock

1+ parts

$11.137

100+ parts

-

1k+ parts

$11.589

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2,136

$11.137

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$11.589

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DigiPath Technology Company

USA . 34 parts In-Stock

1+ parts

$12.263

100+ parts

$11.282

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-

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34

$12.263

$11.282

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ChromeModa Solutions

Germany . 2,587 parts In-Stock

1+ parts

$12.513

100+ parts

$10.261

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2,587

$12.513

$10.261

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IDEA Electronic Components Group

UK . 1,944 parts In-Stock

1+ parts

$12.513

100+ parts

$11.887

1k+ parts

$11.262

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1,944

$12.513

$11.887

$11.262

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AZTECH Wire

Italy . 462 parts In-Stock

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$13.407

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462

$13.407

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One Stop Electronics

USA . 381 parts In-Stock

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$21.000

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381

$21.000

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Component Stockers USA

USA . 339 parts In-Stock

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$99.990

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339

$99.990

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Corphita

USA . 2,667 parts In-Stock

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Microchip USA

USA . 1,278 parts In-Stock

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Overview

Unlock the power of precise data conversion with the TLC1542CDWG4 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unparalleled quality and reliability. With 11 analog input channels and 10 bits of resolution, this compact device offers fast conversion times and low linearity error for accurate results. Ideal for a wide range of applications, this ADC is perfect for industrial automation, sensor interfaces, and more. Trust Texas Instruments to provide the value, benefits, and advantages you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the converter.

No. of Analog In Channels: 11

Allows for the conversion of multiple analog signals simultaneously, increasing efficiency.

Surface Mount: YES

Facilitates easy and secure installation onto circuit boards.

No. of Bits: 10

Offers high resolution and accuracy in digitizing analog input signals.

Maximum Linearity Error (EL): 0.0488 %

Ensures precision in converting analog signals to digital outputs.

Power Supplies (V): 5

Compatible with standard power sources, ensuring ease of integration.

No. of Terminals: 20

Provides ample connectivity options for external connections and interfaces.

Minimum Supply Voltage: 4.5 V

Allows for operation in a wide range of voltage levels, increasing flexibility.

Maximum Operating Temperature: 70 °C

Enables the converter to function reliably in various environmental conditions.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for efficient and low-power operation.

Output Format: SERIAL

Enables easy interfacing with digital systems for data transmission and processing.

Technical Specifications

Analog-to-Digital Converters TLC1542CDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC1542CDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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