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TL1591P

Texas Instruments

TL1591P by Texas Instruments

TL1591P by Texas Instruments is a Sample & Hold IC with 8 terminals, BIFET technology, and 5V nominal voltage. It has a max droop rate of 100 V/s and operates b/w -25 to 80°C. Ideal for sample and hold circuits with fast 0.031 us acquisition time.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,546 parts In-Stock

1+ parts

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4,546

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Digiode

USA . 2,448 parts In-Stock

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2,448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,360 parts In-Stock

1+ parts

$2.197

100+ parts

-

1k+ parts

$2.707

10k+ parts

-

2,360

$2.197

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$2.707

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DigiPath Technology Company

USA . 1,105 parts In-Stock

1+ parts

$2.420

100+ parts

$2.226

1k+ parts

-

10k+ parts

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1,105

$2.420

$2.226

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ChromeModa Solutions

Germany . 6,826 parts In-Stock

1+ parts

$2.469

100+ parts

$2.025

1k+ parts

-

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6,826

$2.469

$2.025

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IDEA Electronic Components Group

UK . 1,932 parts In-Stock

1+ parts

$2.469

100+ parts

-

1k+ parts

$2.222

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1,932

$2.469

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$2.222

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One Stop Electronics

USA . 619 parts In-Stock

1+ parts

$5.410

100+ parts

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619

$5.410

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$7.260

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216

$7.260

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Corphita

USA . 4,253 parts In-Stock

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4,253

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Overview

Unlock precision and reliability with the TL1591P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Sample & Hold ICs that excel in a wide range of applications. The TL1591P offers unparalleled value with its high-quality construction, advanced technology, and commercial-grade performance. Trust Texas Instruments to provide you with a product that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for portable or rugged applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into various systems.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80°C, this product can reliably operate in a wide range of environmental conditions.

Technology: BIFET

The BIFET technology used in this product offers high performance and low power consumption, making it efficient in signal processing applications.

Nominal Acquisition Time: 0.031 us

The fast nominal acquisition time of 0.031 microseconds ensures quick and accurate sampling of input signals, ideal for high-speed applications.

Technical Specifications

Sample & Hold ICs TL1591P attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bi-FET

Total Functions:

1

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

31 ns

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

80 °C (176 °F)

Maximum Droop Rate:

100 V/s

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style (Meter):

In Line

Trade Compliance

TL1591P Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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