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TL1593CNS

Texas Instruments

TL1593CNS by Texas Instruments

TL1593CNS by Texas Instruments is a Sample & Hold IC with 3 functions, operating at 12V. It features a small outline package, dual terminals, and Gull Wing form. Ideal for commercial applications requiring a sample and hold circuit with a max supply current of 28mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,837 parts In-Stock

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4,837

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Digiode

USA . 2,116 parts In-Stock

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2,116

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Distributors (Availability)

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Parana Technologies

USA . 1,839 parts In-Stock

1+ parts

$1.746

100+ parts

-

1k+ parts

$2.322

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1,839

$1.746

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$2.322

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ChromeModa Solutions

Germany . 3,919 parts In-Stock

1+ parts

$1.962

100+ parts

$1.609

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3,919

$1.962

$1.609

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$1.962

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-

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$1.766

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588

$1.962

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$1.766

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One Stop Electronics

USA . 522 parts In-Stock

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$7.410

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522

$7.410

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AZTECH Wire

Italy . 574 parts In-Stock

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$19.446

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574

$19.446

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DigiPath Technology Company

USA . 1,694 parts In-Stock

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$1.769

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1,694

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$1.769

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 714 parts In-Stock

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Kepictronics

USA . 300 parts In-Stock

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Overview

Enhance your electronic projects with the TL1593CNS by Texas Instruments, a top-quality Sample & Hold IC with 3 functions packed into a compact SMALL OUTLINE package. Manufactured by the renowned Texas Instruments, this IC offers unparalleled precision and reliability for a wide range of applications. From industrial automation to consumer electronics, the TL1593CNS delivers superior performance with a nominal supply voltage of 12V and a maximum supply current of 28mA. Elevate your designs with the value and benefits of this exceptional IC today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection of the internal components, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount capability enables easy and efficient integration of the IC into electronic circuits, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in one IC provides versatility and efficiency in circuit design, making it a cost-effective choice for applications requiring multiple functions.

Nominal Supply Voltage / Vsup (V): 12

The nominal supply voltage of 12V ensures compatibility with a wide range of common power sources, making it a versatile choice for various applications.

Maximum Operating Temperature: 45 °C

With a high maximum operating temperature of 45°C, this IC can withstand elevated temperatures, making it suitable for use in industrial or harsh environments.

Technical Specifications

Sample & Hold ICs TL1593CNS attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply Voltage Ratings:

12 V

Total Functions:

3

Sub-Category:

Sample and Hold Circuits

Sampling Mode:

Sample and Hold (S&H)

Operational Characteristics

Nominal Supply Voltage:

12 V

Maximum Supply Voltage:

16 V

Lowest Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

45 °C (113 °F)

Maximum Supply Current:

28 mA

Minimum Analog Input Voltage:

4.6 V

Maximum Analog Input Voltage:

5.6 V

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.209 in (5.3 mm)

Maximum Seated Height:

0.079 in (2 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style (Meter):

Small Outline

Package Equivalence Code:

SOP16,.3

Trade Compliance

TL1593CNS Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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