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TL1591DR

Texas Instruments

TL1591DR by Texas Instruments

TL1591DR by Texas Instruments is a Sample & Hold IC with a max droop rate of 100 V/s, nominal voltage of 5V, and operating temperature range from -25 to 80°C. This BIFET technology-based amplifier is ideal for sample and hold circuit applications due to its fast acquisition time of 0.031 us and small outline package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,636 parts In-Stock

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5,636

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Digiode

USA . 775 parts In-Stock

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775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 292 parts In-Stock

1+ parts

$3.629

100+ parts

$336.964

1k+ parts

$3.266

10k+ parts

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292

$3.629

$336.964

$3.266

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DigiPath Technology Company

USA . 876 parts In-Stock

1+ parts

$3.995

100+ parts

$3.676

1k+ parts

-

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876

$3.995

$3.676

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ChromeModa Solutions

Germany . 3,063 parts In-Stock

1+ parts

$4.077

100+ parts

$3.343

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3,063

$4.077

$3.343

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$4.077

100+ parts

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$3.669

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1,217

$4.077

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$3.669

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One Stop Electronics

USA . 774 parts In-Stock

1+ parts

$7.410

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774

$7.410

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AZTECH Wire

Italy . 458 parts In-Stock

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$8.875

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458

$8.875

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Corphita

USA . 2,713 parts In-Stock

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2,713

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Overview

Enhance your electronic designs with the TL1591DR by Texas Instruments, a top-quality Sample & Hold IC that offers unparalleled performance and reliability. Manufactured by the industry leader in semiconductor technology, this versatile component is perfect for a wide range of applications. With fast acquisition times and precise functionality, the TL1591DR provides exceptional value and benefits to customers looking for high-quality solutions. Upgrade your projects today with Texas Instruments' innovative Sample & Hold ICs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Droop Rate: 100 V/s

Ensures fast and stable voltage holding capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many electronic systems.

No. of Terminals: 8

Provides flexibility in connecting the IC to other components in the circuit.

Maximum Supply Voltage Limit: 7 V

Allows for a buffer zone to protect against voltage spikes, ensuring product longevity.

Maximum Operating Temperature: 80 °C

Can withstand high temperatures, suitable for a variety of operating environments.

Minimum Operating Temperature: -25 °C

Can operate in cold temperatures without performance degradation.

Temperature Grade: COMMERCIAL EXTENDED

Meets industry standards for temperature tolerance, ensuring reliable performance.

Technology: BIFET

Utilizes BIFET technology for improved speed and precision in voltage sampling.

Amplifier Type: SAMPLE AND HOLD CIRCUIT

Designed for accurate sampling and holding of voltage signals, suitable for various applications.

Nominal Acquisition Time: 0.031 us

Provides fast acquisition time, enabling quick and efficient voltage sampling.

Sample-and-Hold/Track-and-Hold: SAMPLE

Specifically designed for sample and hold operations, ensuring accurate signal retention.

Technical Specifications

Sample & Hold ICs TL1591DR attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bi-FET

Total Functions:

1

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

31 ns

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

80 °C (176 °F)

Maximum Droop Rate:

100 V/s

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style (Meter):

Small Outline

Trade Compliance

TL1591DR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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