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LF398D

NXP Semiconductors

LF398D by NXP Semiconductors

SAMPLE AND HOLD CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

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11

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Digiode

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Vyrian

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Anansix

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Elcom Components

USA . 333 parts In-Stock

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Sogenti Electronics

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Prism Electronics

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LIBRA Elektronik GmbH

Germany . 29 parts In-Stock

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LWI Electronics Inc

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Ashlea Components Ltd

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Q Components

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Contempo Components LLC

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Parana Technologies

USA . 664 parts In-Stock

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ChromeModa Solutions

Germany . 3,831 parts In-Stock

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 561 parts In-Stock

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Perfect Parts

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Alle Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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DigiPath Technology Company

USA . 2,022 parts In-Stock

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Corphita

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Technical Specifications

Sample & Hold ICs LF398D attributes and parameters. Explore more Sample & Hold ICs devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Technology:

JFET

Total Functions:

1

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

20 µs

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Supply Voltage:

-18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Analog Input Voltage:

-11.5 V

Maximum Analog Input Voltage:

11.5 V

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style (Meter):

Small Outline

Trade Compliance

LF398D Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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