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OPA615IDG4

Texas Instruments

OPA615IDG4 by Texas Instruments

OPA615IDG4 by Texas Instruments is a Sample & Hold IC with 14 terminals, operating temperature range of -40 to 85°C, and max analog input voltage of ±3V. It features a small outline package style, industrial temperature grade, and bipolar technology. Ideal for sample-and-hold circuit applications requiring precise signal processing in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,480 parts In-Stock

1+ parts

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3,480

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Vyrian

USA . 2,363 parts In-Stock

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2,363

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Distributors (Availability)

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One Stop Electronics

USA . 1,399 parts In-Stock

1+ parts

$4.410

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1,399

$4.410

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Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$4.546

100+ parts

$422.176

1k+ parts

$4.092

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1,554

$4.546

$422.176

$4.092

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DigiPath Technology Company

USA . 1,776 parts In-Stock

1+ parts

$5.006

100+ parts

$4.605

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1,776

$5.006

$4.605

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ChromeModa Solutions

Germany . 1,172 parts In-Stock

1+ parts

$5.108

100+ parts

$4.189

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1,172

$5.108

$4.189

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IDEA Electronic Components Group

UK . 511 parts In-Stock

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$5.108

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$4.597

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511

$5.108

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$4.597

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AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$6.158

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882

$6.158

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Component Stockers USA

USA . 444 parts In-Stock

1+ parts

$99.990

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444

$99.990

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Perfect Parts

USA . 560 parts In-Stock

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560

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Corphita

USA . 487 parts In-Stock

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487

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Overview

Experience unmatched quality and precision with the OPA615IDG4 by Texas Instruments, a leading manufacturer in the industry. This Sample & Hold IC offers unparalleled performance and reliability in a compact package, making it ideal for a wide range of applications. From industrial to consumer electronics, this innovative product delivers exceptional value and benefits to customers seeking top-notch solutions. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the sample & hold IC, ensuring reliable performance over time.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, making the integration of the sample & hold ICs into electronic devices more convenient.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where elevated temperatures may be present.

Maximum Analog Input Voltage: 3 V

Allows for accurate sampling and holding of analog signals within the specified voltage range, ensuring precision in data acquisition.

Technical Specifications

Sample & Hold ICs OPA615IDG4 attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Sample and Hold Circuits

Sampling Mode:

Sample and Hold (S&H)

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Supply Voltage:

-6.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Minimum Analog Input Voltage:

-3 V

Maximum Analog Input Voltage:

3 V

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style (Meter):

Small Outline

Trade Compliance

OPA615IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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