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5962-8760801GX

Texas Instruments

5962-8760801GX by Texas Instruments

5962-8760801GX by Texas Instruments is a MILITARY-grade Sample & Hold IC with 8 terminals and BIPOLAR technology. It operates b/w -55 to 125 °C, with Vsup ranging from -15V to 15V. Ideal for applications requiring fast acquisition time of 6 us and max analog input voltage of +/-11.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,749 parts In-Stock

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7,749

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Digiode

USA . 4,321 parts In-Stock

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4,321

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Anansix

USA . 2,518 parts In-Stock

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2,518

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Resion

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Native Components

USA . 130 parts In-Stock

1+ parts

$0.501

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130

$0.501

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Northwest PG Solutions

USA . 2,353 parts In-Stock

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$0.551

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$0.486

2,353

$0.551

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$0.486

Parana Technologies

USA . 158 parts In-Stock

1+ parts

$1.279

100+ parts

-

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$2.039

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158

$1.279

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$2.039

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ChromeModa Solutions

Germany . 6,165 parts In-Stock

1+ parts

$1.437

100+ parts

$1.178

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6,165

$1.437

$1.178

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IDEA Electronic Components Group

UK . 65 parts In-Stock

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$1.437

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$1.293

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65

$1.437

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$1.293

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One Stop Electronics

USA . 1,610 parts In-Stock

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$4.410

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1,610

$4.410

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AZTECH Wire

Italy . 815 parts In-Stock

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$10.257

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815

$10.257

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DigiPath Technology Company

USA . 1,438 parts In-Stock

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$1.296

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1,438

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$1.296

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Corphita

USA . 1,379 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the 5962-8760801GX by Texas Instruments, a leading manufacturer in the industry. This Sample & Hold IC offers precise performance and durability in various applications. From military to industrial settings, this product delivers exceptional value with quick acquisition times and optimal temperature grades. Trust Texas Instruments to provide top-notch technology that exceeds expectations, making your projects more efficient and reliable. Upgrade to the 5962-8760801GX today and experience the difference firsthand!

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and protection, making the product suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 15

Optimal nominal supply voltage for efficient performance and power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function reliably in extreme conditions.

Maximum Acquisition Time: 6 us

Fast acquisition time ensures accurate and timely sampling of input signals.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in signal processing.

Technical Specifications

Sample & Hold ICs 5962-8760801GX attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Sample and Hold Circuits

Sampling Mode:

Sample and Hold (S&H)

Performance Specifications

Nominal Acquisition Time:

25 µs

Maximum Acquisition Time:

6 µs

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Supply Voltage:

-18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Analog Input Voltage:

-11.5 V

Maximum Analog Input Voltage:

11.5 V

Physical Characteristics

Total Terminals:

8

Terminal Position:

Bottom

Terminal Finish:

Tin Lead

Package Body Material:

Metal

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

Yes

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

O-MBCY-X8

JESD-609 Code:

e0

Packaging and Shipping

Package Shape:

Package Style (Meter):

Cylindrical

Trade Compliance

5962-8760801GX Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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