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TISP7125F3D

Texas Instruments

TISP7125F3D by Texas Instruments

TISP7125F3D by Texas Instruments is a silicon surge protector with 4.3A peak current, 100V DC off-state voltage, and 125V breakdown voltage. It features a delta connected configuration with 3 elements and is ideal for protecting electronic devices from power surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,453 parts In-Stock

1+ parts

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5,453

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Digiode

USA . 3,392 parts In-Stock

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3,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 359 parts In-Stock

1+ parts

$2.764

100+ parts

-

1k+ parts

$3.250

10k+ parts

-

359

$2.764

-

$3.250

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DigiPath Technology Company

USA . 898 parts In-Stock

1+ parts

$3.044

100+ parts

$2.800

1k+ parts

-

10k+ parts

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898

$3.044

$2.800

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$3.106

100+ parts

-

1k+ parts

$2.795

10k+ parts

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1,078

$3.106

-

$2.795

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ChromeModa Solutions

Germany . 398 parts In-Stock

1+ parts

$3.106

100+ parts

$2.547

1k+ parts

-

10k+ parts

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398

$3.106

$2.547

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Semicontronic

India . 1,200 parts In-Stock

1+ parts

$5.100

100+ parts

$4.972

1k+ parts

$4.947

10k+ parts

-

1,200

$5.100

$4.972

$4.947

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AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$10.493

100+ parts

-

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458

$10.493

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One Stop Electronics

USA . 358 parts In-Stock

1+ parts

$18.100

100+ parts

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358

$18.100

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Kepictronics

USA . 2,475 parts In-Stock

1+ parts

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2,475

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Assy Fe

Spain . 850 parts In-Stock

1+ parts

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850

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Corphita

USA . 750 parts In-Stock

1+ parts

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750

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Corohmni

South Africa . 357 parts In-Stock

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357

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Overview

Upgrade your surge protection with the TISP7125F3D by Texas Instruments. Manufactured by a trusted leader in electronics, this silicon surge protector offers reliable and high-quality defense against power surges. Perfect for a variety of applications, this product provides peace of mind for your valuable electronics. Say goodbye to worries about voltage spikes and protect your devices with the TISP7125F3D today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection against external elements, ensuring a longer lifespan for the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with three elements allows for effective distribution and absorption of surge energy, offering reliable protection for connected devices.

Non Repetitive Peak On-state Current: 4.3 A

With a high non-repetitive peak on-state current of 4.3 A, this surge protector can effectively handle sudden surges in electrical current, safeguarding devices from potential damage.

Surface Mount: YES

The surface mount capability makes installation convenient and easy, allowing for seamless integration into various systems and setups.

Package Shape: RECTANGULAR

The rectangular package shape enables space-efficient placement and mounting, making it suitable for applications where size and layout are important factors.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and efficient heat dissipation, enhancing the overall performance and reliability of the surge protector.

No. of Elements: 3

Having three elements provides multiple layers of protection, ensuring comprehensive coverage against different types of surges and voltage spikes.

No. of Terminals: 8

With eight terminals, this surge protector offers versatile connectivity options, allowing for easy integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this surge protector suitable for compact designs and tight spaces, offering flexibility in deployment.

Maximum DC Off-state Voltage: 100 V

The maximum DC off-state voltage of 100 V ensures effective protection against high voltage spikes, safeguarding electronic devices from potential damage.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of a thyristor surge protector as the trigger device enhances the speed and efficiency of surge suppression, providing rapid response to voltage fluctuations.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection, accommodating different wiring setups and configurations.

Maximum Breakdown Voltage: 125 V

With a maximum breakdown voltage of 125 V, this surge protector provides an extra margin of safety, ensuring reliable protection against overvoltage events.

Reference Standard: UL RECOGNIZED

Being UL recognized indicates that this surge protector meets industry safety and performance standards, giving users confidence in its quality and reliability.

Technical Specifications

Silicon Surge Protectors TISP7125F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7125F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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