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TISP7095H3SL

Texas Instruments

TISP7095H3SL by Texas Instruments

TISP7095H3SL by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a non-repetitive peak on-state current of 60A and max breakdown voltage of 95V. Ideal for protecting electronic devices from power surges, it operates b/w -40°C to 150°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,422 parts In-Stock

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8,422

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Digiode

USA . 1,692 parts In-Stock

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1,692

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,931 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

$4.334

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1,931

$3.848

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$4.334

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$4.238

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2,127

$4.238

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ChromeModa Solutions

Germany . 4,251 parts In-Stock

1+ parts

$4.324

100+ parts

$3.546

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4,251

$4.324

$3.546

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$4.324

100+ parts

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$3.892

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1,589

$4.324

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$3.892

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Ampacity Inc.

Singapore . 462 parts In-Stock

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$10.100

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462

$10.100

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AZTECH Wire

Italy . 525 parts In-Stock

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$16.328

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525

$16.328

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One Stop Electronics

USA . 1,544 parts In-Stock

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$20.100

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1,544

$20.100

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Semicontronic

India . 803 parts In-Stock

1+ parts

$28.100

100+ parts

$27.398

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$27.257

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803

$28.100

$27.398

$27.257

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Corphita

USA . 2,883 parts In-Stock

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2,883

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Corohmni

South Africa . 235 parts In-Stock

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Overview

Protect your valuable electronics with the TISP7095H3SL by Texas Instruments, a top-quality silicon surge protector designed to keep your devices safe from power surges and spikes. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this device is built to last. Ideal for a wide range of applications, the TISP7095H3SL offers peace of mind and reliability, ensuring that your equipment stays protected at all times. Upgrade to the TISP7095H3SL today and experience the benefits of superior surge protection for your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for efficient and effective surge protection across multiple paths.

Non Repetitive Peak On-state Current: 60 A

With a non repetitive peak on-state current of 60 A, this surge protector can handle high surge currents, providing reliable protection for connected devices.

Maximum Operating Temperature: 150 °C

The surge protector can operate at high temperatures up to 150°C, making it suitable for a variety of environments and applications.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector ensures quick and effective response to surge events, offering enhanced protection for connected equipment.

Technical Specifications

Silicon Surge Protectors TISP7095H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

95 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

3

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7095H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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