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TISP4250H3BJ

Texas Instruments

TISP4250H3BJ by Texas Instruments

TISP4250H3BJ by Texas Instruments is a single silicon surge protector with 60A non-repetitive peak current. It features a max breakdown voltage of 250V and operates b/w -40°C to 150°C. Ideal for protecting electronic devices from power surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,113 parts In-Stock

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6,113

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Digiode

USA . 3,234 parts In-Stock

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3,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

$2.265

100+ parts

$210.344

1k+ parts

$2.039

10k+ parts

-

2,103

$2.265

$210.344

$2.039

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DigiPath Technology Company

USA . 135 parts In-Stock

1+ parts

$2.494

100+ parts

$2.295

1k+ parts

-

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135

$2.494

$2.295

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IDEA Electronic Components Group

UK . 212 parts In-Stock

1+ parts

$2.545

100+ parts

-

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$2.290

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212

$2.545

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$2.290

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ChromeModa Solutions

Germany . 187 parts In-Stock

1+ parts

$2.545

100+ parts

$2.087

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187

$2.545

$2.087

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Ampacity Inc.

Singapore . 995 parts In-Stock

1+ parts

$6.100

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995

$6.100

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AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$9.793

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718

$9.793

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One Stop Electronics

USA . 1,468 parts In-Stock

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$17.100

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1,468

$17.100

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Semicontronic

India . 869 parts In-Stock

1+ parts

$29.100

100+ parts

$28.372

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$28.227

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869

$29.100

$28.372

$28.227

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Kepictronics

USA . 85,000 parts In-Stock

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85,000

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Corphita

USA . 1,053 parts In-Stock

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1,053

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Corohmni

South Africa . 54 parts In-Stock

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54

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Overview

Protect your valuable electronics with the TISP4250H3BJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality silicon surge protectors that provide reliable protection against power surges and voltage spikes. With its compact design and easy installation, this single configuration device is ideal for a wide range of applications. From home appliances to industrial equipment, the TISP4250H3BJ offers peace of mind and ensures the longevity of your electronic devices. Trust Texas Instruments for superior performance and unmatched protection - because your electronics deserve the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the surge protector, making it suitable for long-term use.

Configuration: SINGLE

The single configuration simplifies installation and operation of the surge protector, making it easy to use.

Non Repetitive Peak On-state Current: 60 A

With a high peak on-state current of 60A, this surge protector can effectively handle surges and protect connected devices.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the surge protector in various locations.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it compact and space-efficient, suitable for installations where space is limited.

Terminal Form: C BEND

The C bend terminal form provides a secure and reliable connection, ensuring proper functioning of the surge protector.

No. of Terminals: 2

With two terminals, the surge protector can easily connect to the circuit, providing effective surge protection.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the surge protector unobtrusive and easy to integrate into various circuits or devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this surge protector can withstand high temperatures and harsh environments.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type ensures fast response to surges, effectively protecting connected equipment from damage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the surge protector to function in cold environments without any issues.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection, allowing for easy integration into different circuits.

Maximum Holding Current: 600 mA

With a maximum holding current of 600mA, this surge protector can effectively suppress surges and protect connected devices.

Maximum Breakdown Voltage: 250 V

The high maximum breakdown voltage of 250V ensures that the surge protector can handle high voltage surges, providing reliable protection.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this surge protector meets the required safety and performance standards, giving peace of mind to users.

Technical Specifications

Silicon Surge Protectors TISP4250H3BJ attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

250 V

Configuration:

Maximum Holding Current:

600 mA

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4250H3BJ Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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