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TISP1072F3P

Texas Instruments

TISP1072F3P by Texas Instruments

TISP1072F3P by Texas Instruments is a silicon surge protector with 6A peak current, 58V off-state voltage, and 72V breakdown voltage. It is used for surge protection in various applications due to its thyristor trigger device type and UL recognition.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,386 parts In-Stock

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6,386

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Digiode

USA . 2,003 parts In-Stock

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2,003

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Distributors (Availability)

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One Stop Electronics

USA . 504 parts In-Stock

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$3.100

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504

$3.100

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Parana Technologies

USA . 1,131 parts In-Stock

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$3.328

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$3.851

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1,131

$3.328

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$3.851

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DigiPath Technology Company

USA . 164 parts In-Stock

1+ parts

$3.664

100+ parts

$3.371

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164

$3.664

$3.371

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ChromeModa Solutions

Germany . 5,186 parts In-Stock

1+ parts

$3.739

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$3.066

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5,186

$3.739

$3.066

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IDEA Electronic Components Group

UK . 436 parts In-Stock

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$3.739

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$3.365

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436

$3.739

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$3.365

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Semicontronic

India . 1,354 parts In-Stock

1+ parts

$12.100

100+ parts

$11.798

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$11.737

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1,354

$12.100

$11.798

$11.737

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AZTECH Wire

Italy . 442 parts In-Stock

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$16.931

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442

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Corphita

USA . 1,712 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP1072F3P by Texas Instruments, a top-of-the-line Silicon Surge Protector. Manufactured by industry leader Texas Instruments, this series-connected, center tap device offers unparalleled protection against voltage spikes and surges. With its durable plastic/epoxy package body material and UL Recognized reference standard, this surge protector is ideal for a wide range of applications. Ensure the safety and longevity of your equipment with the TISP1072F3P, providing peace of mind and safeguarding your investments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the surge protector.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with center tap and 2 elements provides efficient protection against surges by distributing the load evenly.

Non Repetitive Peak On-state Current: 6 A

With a non repetitive peak on-state current of 6 A, this surge protector can handle high current surges effectively.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into various systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and ease of soldering during installation.

Maximum DC Off-state Voltage: 58 V

The maximum DC off-state voltage of 58 V makes this surge protector suitable for various applications with different voltage requirements.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type provides fast response time and reliable protection against transient voltage surges.

Maximum Operating Temperature: 150 °C

The surge protector can operate efficiently at high temperatures up to 150°C, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this surge protector can withstand extreme cold conditions.

Maximum Holding Current: 150 mA

The maximum holding current of 150 mA ensures stable operation of the surge protector under normal operating conditions.

Maximum Breakdown Voltage: 72 V

The maximum breakdown voltage of 72 V provides a safety margin against voltage spikes and ensures long-term reliability of the surge protector.

Reference Standard: UL RECOGNIZED

Being UL Recognized indicates that the surge protector meets industry safety and performance standards, providing peace of mind to users.

Technical Specifications

Silicon Surge Protectors TISP1072F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

72 V

Maximum DC Off-state Voltage:

58 V

Maximum Holding Current:

150 mA

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP1072F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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