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TI380C60PAH

Texas Instruments

TI380C60PAH by Texas Instruments

TI380C60PAH by Texas Instruments is a Network Interfaces IC with 52 terminals, operating at 5V. It features a data rate of 16 Mbps and is ideal for Token Ring applications. The IC operates in commercial temperature range from 0 to 70°C, with a compact square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,223 parts In-Stock

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Digiode

USA . 512 parts In-Stock

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512

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AZTECH Wire

Italy . 431 parts In-Stock

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$5.746

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431

$5.746

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Parana Technologies

USA . 601 parts In-Stock

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$11.551

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$11.961

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601

$11.551

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$11.961

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ChromeModa Solutions

Germany . 4,353 parts In-Stock

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$12.979

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$10.643

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

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$12.979

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$12.330

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$11.681

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$12.979

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One Stop Electronics

USA . 1,215 parts In-Stock

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$767.000

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Corphita

USA . 2,810 parts In-Stock

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DigiPath Technology Company

USA . 1,117 parts In-Stock

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$11.702

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Perfect Parts

USA . 17 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the TI380C60PAH from Texas Instruments. As a trusted leader in network interface technology, Texas Instruments delivers unparalleled quality and reliability. This versatile token ring transceiver is perfect for a wide range of applications, offering fast data rates of up to 16 Mbps. With its compact design and low power consumption, this device provides exceptional value and performance for customers seeking top-notch networking solutions. Trust Texas Instruments to elevate your network experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and facilitating mass production.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with most systems and easy to integrate.

No. of Terminals: 52

With a high number of terminals, this network interface offers plenty of connectivity options for complex networking setups.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile design makes the product space-efficient, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this network interface can withstand moderate to high temperature environments.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high speed performance, making the product energy-efficient and reliable.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage offers compatibility with standard power sources, ensuring ease of integration and use.

Data Rate: 16 Mbps

With a data rate of 16 Mbps, this network interface can handle high-speed data transfer, making it suitable for demanding networking applications.

Technical Specifications

Network Interfaces TI380C60PAH attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP52,.47SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TI380C60PAH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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