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TI380C60APAH

Texas Instruments

TI380C60APAH by Texas Instruments

TI380C60APAH by Texas Instruments is a 52-terminal network interface with 5V power supply, CMOS technology, and 16 Mbps data rate. It is a TOKEN RING TRANSCEIVER suitable for telecom applications due to its compact FLATPACK design and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 16,769 parts In-Stock

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Vyrian

USA . 6,783 parts In-Stock

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6,783

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Zilex Electronics Inc.

Canada . 2,820 parts In-Stock

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2,820

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Resion

USA . 1,809 parts In-Stock

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Digiode

USA . 711 parts In-Stock

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711

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Speed Components Ltd

Israel . 640 parts In-Stock

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640

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Lakeland Logistics Inc

USA . 450 parts In-Stock

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450

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PC Components Company LLC

USA . 63 parts In-Stock

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63

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R&J Components

USA . 15 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,988 parts In-Stock

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$6.687

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$7.384

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$6.687

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$7.384

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DigiPath Technology Company

USA . 1,946 parts In-Stock

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$7.363

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$6.774

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ChromeModa Solutions

Germany . 2,217 parts In-Stock

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$7.513

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$6.161

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$7.513

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

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$7.513

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$6.762

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AZTECH Wire

Italy . 821 parts In-Stock

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$16.899

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One Stop Electronics

USA . 1,542 parts In-Stock

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$957.000

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Kepictronics

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 2,754 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,652 parts In-Stock

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Corphita

USA . 2,411 parts In-Stock

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GreenTree Electronics

Israel . 1,200 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 1,200 parts In-Stock

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1,200

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Speed Components Ltd (Excess)

Israel . 1,200 parts In-Stock

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Assy Fe

Spain . 85 parts In-Stock

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Overview

Experience seamless networking with the TI380C60APAH by Texas Instruments, a top-of-the-line network interface designed for high-speed data transfer. With a trusted manufacturer like Texas Instruments, you can trust in the quality and reliability of this product. Ideal for token ring transceiver applications, this compact device offers advanced technology and a sleek design that will enhance any network setup. Enjoy the benefits of fast data rates and easy installation with the TI380C60APAH, providing value and efficiency to customers looking to optimize their network performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice makes the product lightweight and durable, ideal for network interfaces that may be subject to frequent movement or handling.

Surface Mount: YES

Being surface mountable allows for easy installation onto circuit boards, saving space and enabling efficient placement within devices.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it easy to integrate into various electronic devices with limited space.

Power Supplies (V): 5

The 5V power supply requirement is common and widely available, ensuring compatibility with a wide range of systems and applications.

No. of Terminals: 52

The high number of terminals allows for versatile connectivity options, enabling the network interface to support various functions and communications.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile design offers efficient heat dissipation and space-saving benefits, making it well-suited for compact electronic devices.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, ensuring reliable performance in networking applications.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim profile and compact design, making it suitable for space-constrained environments.

Width: 10 mm

The small width measurement contributes to the product's compact form factor, facilitating integration into various electronic devices.

Length: 10 mm

The short length measurement further highlights the compact design of the network interface, making it versatile for use in different applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high speed performance, enhancing the efficiency and reliability of the network interface.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and easy assembly, ensuring robust connections and simplified installation.

Telecom IC Type: TOKEN RING TRANSCEIVER

The use of a token ring transceiver enables reliable communication in network environments, offering efficient data transfer and network management capabilities.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making it convenient for integration into various electronic systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact spacing of terminals, enabling high-density packaging and efficient use of board space.

Data Rate: 16 Mbps

Supporting a data rate of 16 Mbps ensures high-speed data transfer and reliable performance in networking applications, making it suitable for demanding tasks.

Technical Specifications

Network Interfaces TI380C60APAH attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

16 Mbps

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TI380C60APAH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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