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TI380C60A

Texas Instruments

TI380C60A by Texas Instruments

TI380C60A by Texas Instruments is a 52-terminal network interface in a square, flatpack package. It operates on 5V with CMOS technology and GULL WING terminals. Ideal for TOKEN RING TRANSCEIVER applications due to its compact size and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,400 parts In-Stock

1+ parts

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4,400

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Digiode

USA . 2,739 parts In-Stock

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2,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 669 parts In-Stock

1+ parts

$6.885

100+ parts

-

1k+ parts

$7.499

10k+ parts

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669

$6.885

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$7.499

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DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$7.581

100+ parts

-

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456

$7.581

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ChromeModa Solutions

Germany . 3,544 parts In-Stock

1+ parts

$7.736

100+ parts

$6.344

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3,544

$7.736

$6.344

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IDEA Electronic Components Group

UK . 1,870 parts In-Stock

1+ parts

$7.736

100+ parts

-

1k+ parts

$6.962

10k+ parts

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1,870

$7.736

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$6.962

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AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$10.130

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854

$10.130

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One Stop Electronics

USA . 1,231 parts In-Stock

1+ parts

$15.000

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1,231

$15.000

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Corphita

USA . 3,473 parts In-Stock

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3,473

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Overview

Upgrade your network interface with the TI380C60A by Texas Instruments, a high-quality product designed to meet all your connectivity needs. Manufactured by the reputable Texas Instruments, this token ring transceiver offers unparalleled reliability and performance. Perfect for a wide range of applications, this advanced technology provides seamless communication and data transfer. Say goodbye to connectivity issues and hello to smooth operation with the TI380C60A. Trust in Texas Instruments for cutting-edge solutions that deliver value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it suitable for designs with space constraints.

No. of Terminals: 52

Having 52 terminals allows for versatile connectivity options and supports various functions within the network interface.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style helps in optimizing board space and ensuring efficient thermal management.

Terminal Position: QUAD

The quad terminal position offers better stability and connection reliability, reducing the risk of signal interference.

Maximum Seated Height: 1.2 mm

The low seated height enables a slim design profile and contributes to overall space-saving in the system.

Width: 10 mm

The compact width makes the product suitable for applications where space is limited without compromising on functionality.

Length: 10 mm

The short length further enhances the compact nature of the product, making it easy to integrate into various designs.

Technology: CMOS

The CMOS technology ensures low power consumption, making the product energy-efficient and cost-effective in operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and rework, simplifying the manufacturing and maintenance processes.

Telecom IC Type: TOKEN RING TRANSCEIVER

The inclusion of a token ring transceiver telecom IC type provides specific network capabilities and functionalities, catering to specialized communication requirements.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and easy integration into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density packaging and enables multiple functionalities within a limited space.

Technical Specifications

Network Interfaces TI380C60A attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TI380C60A Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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