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THS6052IDDARG3

Texas Instruments

THS6052IDDARG3 by Texas Instruments

THS6052IDDARG3 by Texas Instruments is a Line Driver with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of +-5/+-15 V and uses BIPOLAR technology for differential input applications. Ideal for industrial settings due to its small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,958 parts In-Stock

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Vyrian

USA . 2,165 parts In-Stock

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2,165

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Distributors (Availability)

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Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

$4.868

100+ parts

-

1k+ parts

$5.395

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1,922

$4.868

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$5.395

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DigiPath Technology Company

USA . 133 parts In-Stock

1+ parts

$5.361

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133

$5.361

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ChromeModa Solutions

Germany . 5,050 parts In-Stock

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$5.470

100+ parts

$4.485

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$5.470

$4.485

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IDEA Electronic Components Group

UK . 504 parts In-Stock

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$5.470

100+ parts

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$4.923

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504

$5.470

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$4.923

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One Stop Electronics

USA . 976 parts In-Stock

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$10.500

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976

$10.500

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AZTECH Wire

Italy . 296 parts In-Stock

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$13.973

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296

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QUARKTWIN TECHNOLOGY LTD

USA . 10,338 parts In-Stock

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Corphita

USA . 3,968 parts In-Stock

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Microchip USA

USA . 131 parts In-Stock

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Overview

Enhance your electronics projects with the THS6052IDDARG3 by Texas Instruments, a top-of-the-line line driver and receiver that guarantees high-quality performance. Manufactured by a trusted industry leader, this product offers unparalleled reliability and precision in a wide range of applications. With its innovative design and advanced technology, the THS6052IDDARG3 delivers exceptional value and benefits to customers, making it a must-have component for any project requiring superior signal transmission capabilities. Upgrade your electronics today with the THS6052IDDARG3 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

Surface Mount YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage 16.5 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions 2

Offers multiple functions within a single device, saving space and reducing the need for additional components.

Package Shape RECTANGULAR

Enables the product to fit efficiently within electronic devices, maximizing use of available space.

Power Supplies (V) +-5/+-15

Provides balanced power supplies for stability and effective operation of the device.

No. of Terminals 8

Offers multiple connection points for flexibility in wiring and connectivity options.

Package Style (Meter) SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Features a compact design with heat sink capabilities, ideal for space-constrained applications while maintaining thermal efficiency.

Minimum Supply Voltage 4.5 V

Works even with low supply voltages, ensuring compatibility with a wide range of power sources.

Maximum Operating Temperature 85 °C

Capable of operating in high-temperature environments, suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature -40 °C

Withstands low temperatures, allowing for reliable performance in various environmental conditions.

Terminal Position DUAL

Dual terminal positioning enhances connectivity and signal transmission capabilities.

Maximum Seated Height 1.68 mm

Low-profile design makes it suitable for compact electronic devices and applications with limited space.

Width 3.9 mm

Narrow width enables efficient placement on circuit boards and minimizes footprint in electronic assemblies.

Length 4.89 mm

Compact length facilitates integration into small devices and tight spaces.

Temperature Grade INDUSTRIAL

Designed to meet industrial-grade standards for reliability and performance in demanding environments.

Maximum Receive Delay 0 ns

Provides immediate response and signal transmission, critical for real-time applications requiring minimal delay.

Technology BIPOLAR

Utilizes bipolar technology for efficient signal processing and power management, enhancing overall performance.

Terminal Form GULL WING

Gull wing terminal form facilitates easy soldering and reliable connections on circuit boards.

Input Characteristics DIFFERENTIAL

Supports differential signaling for improved noise immunity and signal integrity in data transmission.

Nominal Supply Voltage 12 V

Stable nominal supply voltage for consistent performance in various applications.

Nominal Negative Supply Voltage -12 V

Balanced negative supply voltage for optimal operation and signal processing.

Terminal Pitch 1.27 mm

Ideal terminal pitch for easy integration and connection within standard circuit board layouts.

Driver No. of Bits 2

Features a 2-bit driver for efficient signal processing and transmission in data communication.

Interface IC Type LINE DRIVER

Specifically designed as a line driver interface IC, ensuring compatibility and performance in signal transmission applications.

Technical Specifications

Line Drivers & Receivers THS6052IDDARG3 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 9V TO 33V SINGLE SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.68 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

16.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS6052IDDARG3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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