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THS6062IDG4

Texas Instruments

THS6062IDG4 by Texas Instruments

THS6062IDG4 by Texas Instruments is a Line Receiver IC with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 2.5V to 16V and supports differential input characteristics. This small outline package is ideal for industrial applications requiring high-speed signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,400 parts In-Stock

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Digiode

USA . 1,393 parts In-Stock

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1,393

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Parana Technologies

USA . 524 parts In-Stock

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$2.908

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$3.406

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524

$2.908

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$3.406

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ChromeModa Solutions

Germany . 1,724 parts In-Stock

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$3.267

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$2.679

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1,724

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$2.679

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IDEA Electronic Components Group

UK . 559 parts In-Stock

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$3.267

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$2.940

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559

$3.267

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$2.940

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Semicontronic

India . 855 parts In-Stock

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$4.500

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$4.388

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$4.365

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855

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 821 parts In-Stock

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$5.882

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821

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Corohmni

South Africa . 39 parts In-Stock

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$12.372

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Ampacity Inc.

Singapore . 1,467 parts In-Stock

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$22.500

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$22.500

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One Stop Electronics

USA . 1,094 parts In-Stock

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$47.500

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Argo Parts USA

USA . 4,473 parts In-Stock

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Corphita

USA . 1,916 parts In-Stock

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Continental Prestige Electronics

USA . 828 parts In-Stock

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DigiPath Technology Company

USA . 323 parts In-Stock

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$2.946

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323

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$2.946

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Bastille Electronics

Australia . 100 parts In-Stock

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Advanced Electronics

New Zealand . 82 parts In-Stock

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Overview

Unlock the potential of your electronic systems with the THS6062IDG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers top-of-the-line line drivers & receivers like this one, designed to enhance performance and efficiency in various applications. From industrial settings to consumer electronics, this small outline package delivers unmatched value, benefits, and advantages to customers seeking high-quality components for their projects. Trust Texas Instruments to provide the innovative solutions you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Surface Mount: YES

Makes it easy to integrate into various electronic systems and circuit boards.

Maximum Supply Voltage: 16 V

Allows for compatibility with a wide range of power sources.

No. of Functions: 2

Provides versatility and the ability to handle multiple tasks simultaneously.

Minimum Supply Voltage: 2.5 V

Allows for operation in low power environments.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity for efficient signal transmission.

Width: 3.9 mm

Compact size for easy integration and space-saving.

Receiver No. of Bits: 2

Suitable for handling digital signals with precision and accuracy.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions.

Technical Specifications

Line Drivers & Receivers THS6062IDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V TO 32V SINGLE SUPPLY

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-15 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

THS6062IDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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