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THS6053IPWPG4

Texas Instruments

THS6053IPWPG4 by Texas Instruments

THS6053IPWPG4 by Texas Instruments is a Line Driver IC with 2 functions, operating at -40 to 85°C. It has a supply voltage range of ±5/±15V and supports differential inputs. Ideal for industrial applications requiring high-speed signal transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,492 parts In-Stock

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Digiode

USA . 1,599 parts In-Stock

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1,599

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Parana Technologies

USA . 1,977 parts In-Stock

1+ parts

$3.906

100+ parts

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$4.380

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1,977

$3.906

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$4.380

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ChromeModa Solutions

Germany . 2,719 parts In-Stock

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$4.389

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$3.599

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$4.389

$3.599

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IDEA Electronic Components Group

UK . 856 parts In-Stock

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$4.389

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$3.950

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856

$4.389

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$3.950

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Corohmni

South Africa . 140 parts In-Stock

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$9.593

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$9.593

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One Stop Electronics

USA . 1,460 parts In-Stock

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$15.500

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$15.500

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AZTECH Wire

Italy . 217 parts In-Stock

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$16.018

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Ampacity Inc.

Singapore . 1,483 parts In-Stock

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$35.500

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Argo Parts USA

USA . 4,607 parts In-Stock

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Corphita

USA . 3,688 parts In-Stock

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Continental Prestige Electronics

USA . 3,584 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 546 parts In-Stock

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$3.957

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546

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$3.957

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Overview

Enhance the performance of your electronic systems with the THS6053IPWPG4 by industry leader Texas Instruments. This high-quality line driver offers reliable signal transmission and reception in a compact and durable package. Ideal for a wide range of applications, this product provides value through its efficiency, precision, and versatility. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the THS6053IPWPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and making the product ideal for compact electronic designs.

Maximum Supply Voltage: 16.5 V

Can handle higher voltage inputs, providing flexibility in various application scenarios.

No. of Functions: 2

Offers multiple functions in a single device, reducing the need for additional components and simplifying circuit design.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, making it suitable for industrial applications.

Technical Specifications

Line Drivers & Receivers THS6053IPWPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 9V TO 33V SINGLE SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

16.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

THS6053IPWPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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