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THS6072IDGNRG4

Texas Instruments

THS6072IDGNRG4 by Texas Instruments

THS6072IDGNRG4 by Texas Instruments is a Line Receiver IC with 2 functions, operating at -40 to 85°C. It has a supply voltage range of ±5/±15V and terminal pitch of 0.65mm. Ideal for industrial applications requiring differential input characteristics in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,278 parts In-Stock

1+ parts

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7,278

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Digiode

USA . 1,838 parts In-Stock

1+ parts

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1,838

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,037 parts In-Stock

1+ parts

$1.500

100+ parts

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1,037

$1.500

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$8.263

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423

$8.263

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Parana Technologies

USA . 550 parts In-Stock

1+ parts

$9.342

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$9.964

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550

$9.342

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$9.964

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DigiPath Technology Company

USA . 120 parts In-Stock

1+ parts

$10.287

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120

$10.287

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ChromeModa Solutions

Germany . 1,113 parts In-Stock

1+ parts

$10.497

100+ parts

$8.608

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1,113

$10.497

$8.608

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IDEA Electronic Components Group

UK . 1,054 parts In-Stock

1+ parts

$10.497

100+ parts

$9.972

1k+ parts

$9.447

10k+ parts

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1,054

$10.497

$9.972

$9.447

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Ampacity Inc.

Singapore . 1,265 parts In-Stock

1+ parts

$34.500

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1,265

$34.500

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A-Z Elektronik GmbH

Germany . 8,351 parts In-Stock

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Continental Prestige Electronics

USA . 4,418 parts In-Stock

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Argo Parts USA

USA . 3,360 parts In-Stock

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Corphita

USA . 1,704 parts In-Stock

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1,704

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Kepictronics

USA . 1,277 parts In-Stock

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1,277

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the cutting-edge technology of the THS6072IDGNRG4 by Texas Instruments, a top-of-the-line Line Receiver that guarantees superior performance and reliability. With Texas Instruments' reputation for excellence in the industry, this product offers unparalleled quality and precision. Ideal for a wide range of applications, this Line Driver & Receiver is a game-changer in the field. Experience seamless connectivity and enhanced functionality like never before with the THS6072IDGNRG4, providing unmatched value and benefits to all customers. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and lightweight design.

Surface Mount:

YES - Easy to integrate into circuit boards for compact setups.

Maximum Supply Voltage:

16.5 V - Suitable for a wide range of applications requiring higher voltage.

No. of Functions:

2 - Offers versatile functionality in a single package.

Package Shape:

SQUARE - Allows for efficient use of space on PCBs.

Power Supplies (V):

+-5/+-15 - Accommodates various power supply configurations.

No. of Terminals:

8 - Simplifies connections and reduces wiring complexity.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH - Provides flexibility in mounting options.

Minimum Supply Voltage:

4.5 V - Ensures compatibility with low-power systems.

Maximum Operating Temperature:

85 °C - Ideal for industrial environments with elevated temperatures.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures reliable connections and long-term performance.

Terminal Position:

DUAL - Facilitates ease of installation and maintenance.

Maximum Seated Height:

1.07 mm - Enables a low-profile design for space-constrained applications.

Width:

3 mm - Contributes to a compact form factor for efficient PCB layout.

Receiver No. of Bits:

2 - Provides accurate signal reception and processing.

Maximum Time At Peak Reflow Temperature (s):

30 - Resistant to heat stress during manufacturing processes.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering for robust assembly.

Length:

3 mm - Enhances compatibility with standard PCB dimensions.

Temperature Grade:

INDUSTRIAL - Suitable for harsh industrial environments.

Maximum Receive Delay:

0 ns - Ensures quick response times for real-time applications.

Technology:

BIPOLAR - Offers stable performance and reliability in diverse conditions.

Terminal Form:

GULL WING - Facilitates easy soldering and secure connections.

Input Characteristics:

DIFFERENTIAL - Provides noise immunity and signal integrity in noisy environments.

Nominal Supply Voltage:

15 V - Meets the power requirements of most applications.

Nominal Negative Supply Voltage:

15 V - Supports dual-supply operations for balanced signal processing.

Terminal Pitch:

0.65 mm - Allows for fine-pitch mounting on PCBs for high-density layouts.

Interface IC Type:

LINE RECEIVER - Designed for efficient and accurate signal reception in communication systems.

Technical Specifications

Line Drivers & Receivers THS6072IDGNRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 9V TO 33V SINGLE SUPPLY

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-15 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.07 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

16.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

THS6072IDGNRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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