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THS6052IDDAR

Texas Instruments

THS6052IDDAR by Texas Instruments

THS6052IDDAR by Texas Instruments is a Line Driver IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of +-5/+-15 V and Gull Wing terminals on an 8-terminal package. Ideal for industrial applications requiring bipolar technology and differential input characteristics with no receive delay.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,307 parts In-Stock

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5,307

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Digiode

USA . 2,981 parts In-Stock

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2,981

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Distributors (Availability)

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

$11.120

100+ parts

-

1k+ parts

$11.574

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934

$11.120

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$11.574

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$12.244

100+ parts

$11.265

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1,594

$12.244

$11.265

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ChromeModa Solutions

Germany . 2,350 parts In-Stock

1+ parts

$12.494

100+ parts

$10.245

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2,350

$12.494

$10.245

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IDEA Electronic Components Group

UK . 738 parts In-Stock

1+ parts

$12.494

100+ parts

$11.869

1k+ parts

$11.245

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738

$12.494

$11.869

$11.245

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AZTECH Wire

Italy . 752 parts In-Stock

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$16.904

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752

$16.904

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One Stop Electronics

USA . 851 parts In-Stock

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$44.500

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851

$44.500

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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538

$99.990

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Corphita

USA . 3,030 parts In-Stock

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Microchip USA

USA . 145 parts In-Stock

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145

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Overview

Elevate your electronics projects with the THS6052IDDAR by Texas Instruments. This top-of-the-line line driver delivers unparalleled performance and reliability, thanks to the renowned quality of its manufacturer. Perfect for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Upgrade your designs with confidence, knowing that you're getting a superior product that will exceed your expectations every time. Trust Texas Instruments to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 16.5 V

Can handle high voltage inputs, providing versatility in a variety of electronic applications.

No. of Functions: 2

Having multiple functions in one device can save space on the circuit board and simplify the overall design.

Power Supplies (V): +-5/+-15

Supports dual power supplies, enabling flexibility in power configurations for different system requirements.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Compact design with heat sink capabilities allows for efficient heat dissipation and space-saving in tight layouts.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, ensuring performance under various conditions.

Minimum Operating Temperature: -40 °C

Designed to withstand low temperatures, making it suitable for use in cold environments or outdoor applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and accuracy, ideal for demanding signal processing tasks.

Nominal Supply Voltage: 12 V

Provides a stable voltage supply for consistent and reliable operation of the device.

Technical Specifications

Line Drivers & Receivers THS6052IDDAR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 9V TO 33V SINGLE SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.68 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

16.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS6052IDDAR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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