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THS6042CDDAR

Texas Instruments

THS6042CDDAR by Texas Instruments

THS6042CDDAR by Texas Instruments is a Line Driver with 2 functions, operating at 5-15V. It has a small outline package and operates b/w 0-70°C. Ideal for differential input applications requiring high-speed signal transmission in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,832 parts In-Stock

1+ parts

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4,832

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Vyrian

USA . 2,122 parts In-Stock

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2,122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$5.031

100+ parts

-

1k+ parts

$5.587

10k+ parts

-

1,621

$5.031

-

$5.587

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DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$5.540

100+ parts

$5.097

1k+ parts

-

10k+ parts

-

681

$5.540

$5.097

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$5.653

100+ parts

-

1k+ parts

$5.088

10k+ parts

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1,283

$5.653

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$5.088

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ChromeModa Solutions

Germany . 143 parts In-Stock

1+ parts

$5.653

100+ parts

$4.635

1k+ parts

-

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143

$5.653

$4.635

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AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$5.701

100+ parts

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516

$5.701

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One Stop Electronics

USA . 979 parts In-Stock

1+ parts

$26.500

100+ parts

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979

$26.500

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Corphita

USA . 1,203 parts In-Stock

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1,203

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Microchip USA

USA . 229 parts In-Stock

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229

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Overview

Experience unmatched performance and reliability with the THS6042CDDAR by Texas Instruments, a cutting-edge line driver perfect for a wide range of applications. With Texas Instruments' reputation for superior quality and innovation, this product offers customers unparalleled value and benefits. Whether you're looking to enhance communication systems, data transmission, or audio equipment, this line driver delivers exceptional results with its advanced technology and precision engineering. Trust Texas Instruments to provide top-notch solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the line driver & receiver, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 15 V

Can handle higher supply voltages, making it versatile and compatible with a wide range of applications.

No. of Functions: 2

Provides dual functionality in a single package, saving cost and board space.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to design and integrate into circuit layouts.

Maximum Operating Temperature: 70 °C

Can operate efficiently in high-temperature environments, ensuring reliability in various conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning at low temperatures, suitable for a wide range of operating environments.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making it ideal for applications requiring fast signal processing.

Input Characteristics: DIFFERENTIAL

Differential inputs provide noise immunity and improved signal integrity, making it reliable in noisy environments.

Nominal Supply Voltage: 12 V

The nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Line Drivers & Receivers THS6042CDDAR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 10V TO 30V SINGLE SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.68 mm

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS6042CDDAR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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