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THS3125CDG4

Texas Instruments

THS3125CDG4 by Texas Instruments

THS3125CDG4 by Texas Instruments is a video amplifier IC with 2 functions, operating at 0-70°C. It has a bandwidth of 160 kHz, suitable for audio/video applications. This small outline package IC requires a supply voltage of 5-15V and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,710 parts In-Stock

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2,710

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Vyrian

USA . 2,609 parts In-Stock

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2,609

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$0.185

100+ parts

$17.191

1k+ parts

$0.167

10k+ parts

-

1,209

$0.185

$17.191

$0.167

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DigiPath Technology Company

USA . 900 parts In-Stock

1+ parts

$0.204

100+ parts

$0.188

1k+ parts

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900

$0.204

$0.188

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ChromeModa Solutions

Germany . 6,411 parts In-Stock

1+ parts

$0.208

100+ parts

$0.171

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6,411

$0.208

$0.171

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

1+ parts

$0.208

100+ parts

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$0.187

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2,223

$0.208

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$0.187

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Semicontronic

India . 1,292 parts In-Stock

1+ parts

$2.800

100+ parts

$2.730

1k+ parts

$2.716

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1,292

$2.800

$2.730

$2.716

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One Stop Electronics

USA . 1,447 parts In-Stock

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$4.800

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1,447

$4.800

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AZTECH Wire

Italy . 412 parts In-Stock

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$16.437

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412

$16.437

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Corphita

USA . 4,005 parts In-Stock

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4,005

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Microchip USA

USA . 394 parts In-Stock

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394

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Overview

Enhance your audio and video projects with the THS3125CDG4 by Texas Instruments, a premium quality video amplifier that delivers exceptional performance. With a reputation for excellence in manufacturing, Texas Instruments ensures reliability and innovation in every product. Ideal for a wide range of applications in the audio and video amplification category, this versatile amplifier offers value, benefits, and advantages that cater to the needs of customers seeking superior sound and picture quality. Upgrade your projects today with the THS3125CDG4 and experience top-notch performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

No. of Functions: 2

Having 2 functions in one component reduces the need for multiple separate components, saving space and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle during assembly and maintenance.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video performance.

No. of Terminals: 14

Having 14 terminals provides flexibility in connection options and compatibility with various circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures without affecting performance.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures usability in a wide range of environments, including colder temperatures.

Terminal Position: DUAL

Dual terminal position allows for efficient and secure connections in the circuit.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm helps in reducing the overall size of the electronic device and facilitates compact design.

Width: 3.9 mm

The narrow width of 3.9 mm contributes to space-saving design and allows for tight placement on the circuit board.

Minimum Supply Voltage (Vsup): 5 V

The minimum supply voltage of 5V ensures compatibility with various power sources and operating conditions.

Length: 8.65 mm

With a length of 8.65 mm, this product is compact and suitable for small electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets industry standards and is suitable for mass production.

Nominal Bandwidth: 160 kHz

With a nominal bandwidth of 160 kHz, this product is capable of amplifying video signals with high clarity and resolution.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and PCB mounting, enhancing the reliability of the product.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm facilitates easy connections and prevents short circuits in the circuit.

Maximum Supply Voltage (Vsup): 15 V

The maximum supply voltage of 15V allows for a wide range of input voltages, making this product versatile and adaptable.

Technical Specifications

Audio & Video Amplifiers THS3125CDG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH SINGLE 10V TO 30 V SUPPLY

Nominal Bandwidth:

160 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS3125CDG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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