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THS3125CD

Texas Instruments

THS3125CD by Texas Instruments

THS3125CD by Texas Instruments is a video amplifier with 2 functions, operating at 0-70°C. It has a bandwidth of 160 kHz, suitable for audio/video applications. This small outline IC features surface mount technology and operates b/w 5-15V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,020 parts In-Stock

1+ parts

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8,020

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Digiode

USA . 4,313 parts In-Stock

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4,313

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,255 parts In-Stock

1+ parts

$1.054

100+ parts

$97.858

1k+ parts

$0.948

10k+ parts

-

1,255

$1.054

$97.858

$0.948

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DigiPath Technology Company

USA . 1,374 parts In-Stock

1+ parts

$1.160

100+ parts

$1.067

1k+ parts

-

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1,374

$1.160

$1.067

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ChromeModa Solutions

Germany . 4,629 parts In-Stock

1+ parts

$1.184

100+ parts

$0.971

1k+ parts

-

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4,629

$1.184

$0.971

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IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$1.184

100+ parts

-

1k+ parts

$1.066

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778

$1.184

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$1.066

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One Stop Electronics

USA . 1,621 parts In-Stock

1+ parts

$6.800

100+ parts

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1,621

$6.800

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AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$9.092

100+ parts

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758

$9.092

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Corphita

USA . 1,966 parts In-Stock

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1,966

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Microchip USA

USA . 443 parts In-Stock

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443

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Overview

Enhance your audio and video experiences with the THS3125CD by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers top-of-the-line audio & video amplifiers that offer unparalleled performance and reliability. Whether you're looking to amplify sound or enhance visual displays, this versatile IC is designed to meet your needs. With a wide range of applications and user-friendly features, the THS3125CD provides exceptional value and benefits for all customers. Upgrade your audio and video systems today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the overall design.

Package Shape: RECTANGULAR

The rectangular shape is compact and efficient, making it easy to incorporate into various electronic applications.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video output and signal amplification.

No. of Terminals: 14

Having multiple terminals allows for versatile connection options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding environments and prolonged use.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures reliable performance in various temperature conditions.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal transmission for enhanced reliability.

Maximum Seated Height: 1.75 mm

The low seated height allows for compact integration and space-saving in electronic designs.

Width: 3.9 mm

The narrow width is suitable for applications with limited space, enabling versatile installation options.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage requirement allows for energy-efficient operation and compatibility with various power sources.

Length: 8.65 mm

The moderate length provides a balance between compact design and easy handling during installation.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and performance in typical operational environments.

Nominal Bandwidth: 160 kHz

The high nominal bandwidth supports high-frequency video signals, providing clear and sharp video output.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections for improved electrical conductivity.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact layout designs and efficient use of space on the circuit board.

Maximum Supply Voltage (Vsup): 15 V

The high maximum supply voltage ensures compatibility with a wide range of power sources for versatile applications.

Technical Specifications

Audio & Video Amplifiers THS3125CD attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH SINGLE 10V TO 30 V SUPPLY

Nominal Bandwidth:

160 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS3125CD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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