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THS1230IPWRG4

Texas Instruments

THS1230IPWRG4 by Texas Instruments

THS1230IPWRG4 by Texas Instruments is a 12-bit ADC with 0.0488% EL, 30 MHz sample rate, and 3.3V supply voltage. Ideal for industrial applications, it offers fast conversion time of 0.033 us and operates b/w -40 to 85 °C. Its compact design in PLASTIC/EPOXY package makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,134 parts In-Stock

1+ parts

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100+ parts

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9,134

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Digiode

USA . 2,055 parts In-Stock

1+ parts

-

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-

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2,055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 9,134 parts In-Stock

1+ parts

$5.830

100+ parts

$5.600

1k+ parts

$5.490

10k+ parts

$5.380

9,134

$5.830

$5.600

$5.490

$5.380

Parana Technologies

USA . 872 parts In-Stock

1+ parts

$20.439

100+ parts

-

1k+ parts

$20.489

10k+ parts

-

872

$20.439

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$20.489

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ChromeModa Solutions

Germany . 2,204 parts In-Stock

1+ parts

$22.965

100+ parts

$18.831

1k+ parts

-

10k+ parts

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2,204

$22.965

$18.831

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IDEA Electronic Components Group

UK . 74 parts In-Stock

1+ parts

$22.965

100+ parts

$21.817

1k+ parts

$20.668

10k+ parts

-

74

$22.965

$21.817

$20.668

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One Stop Electronics

USA . 775 parts In-Stock

1+ parts

$29.000

100+ parts

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775

$29.000

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Corphita

USA . 3,103 parts In-Stock

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3,103

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DigiPath Technology Company

USA . 1,912 parts In-Stock

1+ parts

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100+ parts

$20.705

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1,912

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$20.705

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Microchip USA

USA . 139 parts In-Stock

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139

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Overview

Unlock the power of precision with the THS1230IPWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that set the standard for quality and reliability. This versatile device is perfect for a wide range of applications, offering customers unparalleled value and performance. Experience the benefits of high accuracy, fast conversion times, and a compact design that meets the demands of industrial settings. Trust Texas Instruments to provide cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 12

Higher number of bits allows for more precise digital conversion of analog signals, resulting in accurate data representation.

Maximum Linearity Error (EL): 0.0488 %

Low linearity error ensures accurate and reliable conversion of analog signals into digital data.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage of 3.3V, making it compatible with common power sources.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space and allows for easy integration into electronic devices with limited room for components.

No. of Terminals: 28

Ample number of terminals provide flexibility in connecting the converter to other components within a circuit.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures of up to 85°C, suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions down to -40°C, making it versatile for various environments.

Maximum Conversion Time: 0.033 us

Quick conversion time ensures fast processing of analog data, ideal for applications requiring real-time data acquisition.

Width: 4.4 mm

Narrow width allows for compact placement on circuit boards, contributing to space efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the converter.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, ensuring reliability and durability in harsh operating conditions.

Maximum Analog Input Voltage: 2 V

Accepts a maximum analog input voltage of 2V, making it compatible with a wide range of input signals.

Sample Rate: 30 MHz

High sample rate allows for accurate capturing of fast-changing analog signals, suitable for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminals provide strong solder connections and ease of mounting onto PCBs, ensuring reliable performance.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary conversion method ensures unique and optimized performance tailored to specific requirements of the application.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and interpretation in digital systems, enhancing compatibility.

Output Format: PARALLEL, WORD

Parallel output format in word structure allows for efficient data transmission and processing in digital systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality enables accurate sampling and conversion of analog input signals, ensuring data integrity.

Technical Specifications

Analog-to-Digital Converters THS1230IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

30 MHz

Hold Mode:

Sample

Maximum Conversion Time:

33 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

THS1230IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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