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THS1230IPWG4

Texas Instruments

THS1230IPWG4 by Texas Instruments

THS1230IPWG4 by Texas Instruments is a 12-bit ADC with 0.0488% EL, 30 MHz sample rate, and 3.3V supply voltage. Ideal for industrial applications, it offers a compact design in a small outline package for precise analog-to-digital conversion with high linearity and fast conversion times.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,666 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,666

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Vyrian

USA . 2,615 parts In-Stock

1+ parts

-

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2,615

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,616 parts In-Stock

1+ parts

$4.732

100+ parts

-

1k+ parts

$5.229

10k+ parts

-

1,616

$4.732

-

$5.229

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DigiPath Technology Company

USA . 21 parts In-Stock

1+ parts

$5.211

100+ parts

$4.794

1k+ parts

-

10k+ parts

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21

$5.211

$4.794

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ChromeModa Solutions

Germany . 6,885 parts In-Stock

1+ parts

$5.317

100+ parts

$4.360

1k+ parts

-

10k+ parts

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6,885

$5.317

$4.360

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IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$5.317

100+ parts

-

1k+ parts

$4.785

10k+ parts

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251

$5.317

-

$4.785

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One Stop Electronics

USA . 1,018 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,018

$9.000

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$10.506

100+ parts

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703

$10.506

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Component Stockers USA

USA . 592 parts In-Stock

1+ parts

$99.990

100+ parts

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592

$99.990

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Corphita

USA . 1,593 parts In-Stock

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1,593

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Microchip USA

USA . 465 parts In-Stock

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465

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Overview

Discover the exceptional performance and reliability of the THS1230IPWG4 Analog-to-Digital Converter by Texas Instruments. With cutting-edge technology and superior craftsmanship, this 12-bit ADC offers unparalleled precision and accuracy in a compact, easy-to-install package. Ideal for industrial applications, this converter guarantees seamless operation even in extreme conditions. Unlock new possibilities and enhance your projects with the value and benefits that only Texas Instruments can provide. Upgrade to the THS1230IPWG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to temperature changes, ensuring long-term reliability.

No. of Bits: 12

With 12 bits resolution, this ADC can provide high accuracy and precision in converting analog signals to digital, making it suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.0488 %

Low linearity error ensures accurate conversion of analog signals, making this ADC suitable for applications where precision is crucial.

Power Supplies (V): 3.3

Operating at a common voltage of 3.3V makes it compatible with a wide range of electronic systems, simplifying integration into existing designs.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of 85°C, this ADC can withstand harsh environmental conditions, making it suitable for industrial applications.

Sample Rate: 30 MHz

High sample rate of 30 MHz allows for fast and accurate conversion of analog signals, making it ideal for applications requiring real-time data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC energy-efficient and reliable in noisy environments.

Technical Specifications

Analog-to-Digital Converters THS1230IPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

30 MHz

Hold Mode:

Sample

Maximum Conversion Time:

33 ns

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1230IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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