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THS1206CDAR

Texas Instruments

THS1206CDAR by Texas Instruments

THS1206CDAR by Texas Instruments is a 12-bit ADC with 4 analog in channels, 6 MHz sample rate, and 0.0366% linearity error. Ideal for commercial applications, it operates at temperatures from 0 to 70°C and has a small outline package with dual terminals for surface mount assembly.

Median Price

$39.128

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,358 parts In-Stock

1+ parts

-

100+ parts

$34.780

1k+ parts

$31.120

10k+ parts

$29.290

1,358

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$34.780

$31.120

$29.290

DigiKey

USA . 1,358 parts In-Stock

1+ parts

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1,358

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Verical

USA . 1,358 parts In-Stock

1+ parts

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100+ parts

$43.475

1k+ parts

$38.900

10k+ parts

$36.612

1,358

-

$43.475

$38.900

$36.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,950 parts In-Stock

1+ parts

$18.364

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4,950

$18.364

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Vyrian

USA . 4,457 parts In-Stock

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4,457

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ACDS - Activité Composants Distribution Service

France . 1,971 parts In-Stock

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Sensible Micro Corp

USA . 1,894 parts In-Stock

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DigiKey Marketplace

USA . 1,688 parts In-Stock

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Chip Stock

USA . 556 parts In-Stock

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556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

$13.764

100+ parts

-

1k+ parts

$14.251

10k+ parts

-

1,476

$13.764

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$14.251

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DigiPath Technology Company

USA . 84 parts In-Stock

1+ parts

$15.156

100+ parts

$13.943

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10k+ parts

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84

$15.156

$13.943

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ChromeModa Solutions

Germany . 1,612 parts In-Stock

1+ parts

$15.465

100+ parts

$12.681

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1,612

$15.465

$12.681

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$15.465

100+ parts

$14.692

1k+ parts

$13.918

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92

$15.465

$14.692

$13.918

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Corphita

USA . 1,226 parts In-Stock

1+ parts

$17.397

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1,226

$17.397

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QUARKTWIN TECHNOLOGY LTD

USA . 28,912 parts In-Stock

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Authorized Procurement Solutions

USA . 1,971 parts In-Stock

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1,971

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GreenTree Electronics

Israel . 1,971 parts In-Stock

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1,971

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Overview

Experience unparalleled precision and reliability with the THS1206CDAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Analog-to-Digital Converters that are essential for a wide range of applications. With 4 analog input channels and a 12-bit resolution, this converter offers superior performance and accuracy. Whether you're designing medical devices, industrial automation systems, or high-speed communication equipment, the THS1206CDAR provides unmatched value, efficiency, and versatility. Trust Texas Instruments to elevate your projects to the next level with top-quality components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring long-term reliability.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile applications and the ability to monitor multiple signals simultaneously.

Surface Mount: YES

Ease of installation and integration into circuit boards, making it suitable for compact designs and mass production.

No. of Bits: 12

Higher resolution with 12 bits allows for finer and more accurate digital representation of analog signals.

Maximum Linearity Error (EL): 0.0366 %

Low linearity error ensures accurate conversion of analog signals to digital, maintaining signal integrity.

Power Supplies (V): 3.3/5

Compatibility with common power supply voltages ensures ease of integration in various electronic systems.

No. of Terminals: 32

Sufficient terminals for connection with other components, offering flexibility for different circuit configurations.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making the converter efficient and reliable.

Technical Specifications

Analog-to-Digital Converters THS1206CDAR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0366 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Maximum Conversion Time:

175 ns

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

1.4 V

Maximum Analog Input Voltage:

4 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

40 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1206CDAR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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