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THS1030IDW

Texas Instruments

THS1030IDW by Texas Instruments

THS1030IDW by Texas Instruments is a 10-bit ADC with 0.1953% EL, 30 MHz sample rate, and 5.5V max analog input voltage. Ideal for industrial applications requiring high-speed data conversion in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,363 parts In-Stock

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Digiode

USA . 2,751 parts In-Stock

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R&J Components

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,319 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 245 parts In-Stock

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$10.759

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$10.759

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Parana Technologies

USA . 1,741 parts In-Stock

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$15.635

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$16.000

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$15.635

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ChromeModa Solutions

Germany . 3,058 parts In-Stock

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$17.567

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$14.405

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$17.567

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

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$17.567

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$16.689

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$15.810

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Component Stockers USA

USA . 639 parts In-Stock

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$99.990

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639

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A-Z Elektronik GmbH

Germany . 6,024 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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DigiPath Technology Company

USA . 1,591 parts In-Stock

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$15.838

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Corphita

USA . 501 parts In-Stock

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Perfect Parts

USA . 426 parts In-Stock

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Microchip USA

USA . 347 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the THS1030IDW from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their Analog-to-Digital Converters. Ideal for a wide range of applications, this 10-bit ADC offers customers unmatched value and benefits, delivering accurate results with minimal error. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and enhances your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the converter from external damage.

No. of Bits: 10

Provides high resolution for accurate data conversion.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without performance issues.

Sample Rate: 30 MHz

High sample rate allows for fast and accurate data conversion.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Nominal Supply Voltage: 3.3 V

Works efficiently with a standard supply voltage, making it easy to integrate into existing systems.

Technical Specifications

Analog-to-Digital Converters THS1030IDW attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

30 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS1030IDW Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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