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THS10064IDAG4

Texas Instruments

THS10064IDAG4 by Texas Instruments

THS10064IDAG4 by Texas Instruments is a 10-bit ADC with 4 analog in channels, operating at 6 MHz sample rate. It has a max linearity error of 0.0977% and supports binary output format. Ideal for industrial applications requiring high-speed data conversion with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,955 parts In-Stock

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Digiode

USA . 75 parts In-Stock

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75

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Distributors (Availability)

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Ampacity Inc.

Singapore . 809 parts In-Stock

1+ parts

$12.000

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809

$12.000

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AZTECH Wire

Italy . 199 parts In-Stock

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$17.727

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$17.727

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One Stop Electronics

USA . 1,002 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 128 parts In-Stock

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$20.787

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$20.942

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128

$20.787

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$20.942

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DigiPath Technology Company

USA . 1,727 parts In-Stock

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$22.889

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$21.058

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$22.889

$21.058

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ChromeModa Solutions

Germany . 3,300 parts In-Stock

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$23.356

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$19.152

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$23.356

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

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$23.356

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$22.188

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$21.020

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A-Z Elektronik GmbH

Germany . 6,459 parts In-Stock

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Lixinc

USA . 5,005 parts In-Stock

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Corphita

USA . 4,159 parts In-Stock

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Microchip USA

USA . 1,873 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the THS10064IDAG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that cater to a wide range of applications. Offering 10 bits of accuracy and a compact design, this ADC is perfect for industrial settings where reliability is key. Experience seamless integration, high-speed sampling, and exceptional linearity with the THS10064IDAG4. Upgrade your systems today and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a variety of industrial applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for more flexibility in connecting and measuring multiple analog signals simultaneously.

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on the PCB, making the product ideal for compact designs.

No. of Bits: 10

With a higher number of bits, the ADC can provide more precise and accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0977%

The low linearity error ensures accurate conversion and reliable performance of the ADC.

Power Supplies (V): 3/5,5

Support for multiple power supply voltages allows for greater flexibility in system integration and operation.

No. of Terminals: 32

More terminals provide better connectivity options and signal routing capabilities for the ADC.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and low-profile package design saves space on the PCB and enables integration into small form factor devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement makes the ADC suitable for low-power applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows the ADC to function reliably in harsh environments or industrial settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the ADC can operate in extreme temperature conditions without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of these materials for terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer redundancy and improved signal integrity for critical applications.

Maximum Seated Height: 1.2 mm

The low seated height saves space on the PCB and enables the ADC to be used in compact electronic devices.

Width: 6.1 mm

The compact width of the ADC allows for efficient space utilization in PCB layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during the manufacturing process.

Length: 11 mm

The moderate length of the ADC provides a balance between space savings and ease of handling during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the ADC's suitability for rugged industrial environments with varying temperature conditions.

Maximum Analog Input Voltage: 4.05 V

The high maximum analog input voltage allows for a wide range of analog signal inputs without risking damage to the ADC.

Sample Rate: 6 MHz

The high sample rate enables fast and accurate conversion of analog signals, making the ADC ideal for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the ADC.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Maximum Supply Current: 40 mA

The low maximum supply current requirement helps in reducing power consumption and heat dissipation in the system.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method used in the ADC's conversion process may offer unique performance advantages compared to standard ADCs.

Nominal Supply Voltage: 5 V

Having a standard nominal supply voltage simplifies integration with other components in the system.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Support for both binary and 2's complement binary output bit codes allows for compatibility with different digital systems.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on the PCB, saving space and improving overall system efficiency.

Minimum Analog Input Voltage: 1.4 V

The low minimum analog input voltage allows for accurate conversion of low-level analog signals without amplification.

Output Format: PARALLEL, WORD

Support for parallel and word output formats offers flexibility in interfacing the ADC with different types of digital systems.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold function captures and maintains the input signal during the conversion process, ensuring accurate data acquisition.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the ADC has a low sensitivity to moisture, ensuring reliability in humid environments or during storage.

Technical Specifications

Analog-to-Digital Converters THS10064IDAG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

6 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

1.4 V

Maximum Analog Input Voltage:

4.05 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

40 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.24 in (6.1 mm)

Length:

0.433 in (11 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP32,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

THS10064IDAG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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